公开(公告)号：US20250020998A1

公开(公告)日：2025-01-16

申请号：US18633948

申请日：2024-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungoh Kim ,  Jaemyoung Kim ,  Seungwook Shin ,  Wanhee Lim ,  Moohyun Koh ,  Minsoo Kim ,  Seungwoo Jang ,  Suk Koo Hong

IPC: G03F7/004 ,  H01L21/027 ,  H01L21/308 ,  H01L21/311 ,  H01L21/3213

Abstract: A photoresist composition includes an organometallic compound, which includes at least one metal-ligand bond including a metal core and at least one organic ligand bonded to the metal core; at least one first organic ligand precursor, which is different in chemical structure from the at least one organic ligand of the organometallic compound, and which includes a phosphonic acid group and has a structure capable of forming a coordination complex with the metal core; and a solvent. A method of manufacturing an integrated circuit device includes forming a photoresist film on a substrate using the photoresist composition, and forming a modified organometallic compound by binding an organic ligand including a phosphonic acid group to the organometallic compound through a ligand exchange between the organometallic compound and the at least one first organic ligand precursor based on chemical equilibrium in the photoresist film.