公开(公告)号：US20240258157A1

公开(公告)日：2024-08-01

申请号：US18411164

申请日：2024-01-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinyong LEE ,  Yungi CHOI ,  Jihye KIM ,  Taewon KIM ,  Yun PARK ,  Jaeyoung SEO ,  Gyeore LEE ,  Heesu EOM

IPC: H01L21/768 ,  H01L23/522

CPC classification number: H01L21/76814 ,  H01L21/76816 ,  H01L23/5226

Abstract: A wiring structure includes an etch stop film disposed on a substrate. A first insulating film is disposed on the etch stop film. A first wiring layer extends in a vertical direction perpendicular to an upper surface of the substrate and extends through the first insulating film and the etch stop film. A sidewall of the first wiring layer forms a first inclination angle of about 88 degrees to about 90 degrees with respect to a first horizontal direction parallel to the upper surface of the substrate. A surface of the first insulating film and a surface of the etch stop film in direct contact with the first wiring layer have a carbon (C) concentration less than or equal to about 3 at %.

公开(公告)号：US20200293093A1

公开(公告)日：2020-09-17

申请号：US16804165

申请日：2020-02-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsoo KIM ,  Bongsub KIM ,  Taewon KIM ,  Sangmin LEE ,  Jongheon LEE ,  Jiwoo LEE

IPC: G06F1/16

Abstract: According to one aspect of the disclosure an electronic device comprises a foldable housing including: a hinge structure, a first housing structure connected to the hinge structure, and including a first face and a second face opposite the first face, and a second housing structure connected to the hinge structure and including a third face and a fourth face opposite the third face, the second housing structure being configured to be rotated about the hinge structure; a flexible display extending over the first face and over the third face; at least one sensor disposed within the foldable housing, and configured to sense an angle formed between the first face and the third face; a first haptic actuator disposed within the first housing structure; a second haptic actuator disposed within the second housing structure; at least one processor disposed within the first housing structure or the second housing structure, and operatively connected to the flexible display, the at least one sensor, the first haptic actuator, and the second haptic actuator. The at least one processor may detect a folding state of the foldable housing using the at least one sensor, and independently control the first haptic actuator and the second haptic actuator based on at least part of the detected folding state.

公开(公告)号：US20230048158A1

公开(公告)日：2023-02-16

申请号：US17973014

申请日：2022-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsoo KIM ,  Bongsub KIM ,  Taewon KIM ,  Sangmin LEE ,  Jongheon LEE ,  Jiwoo LEE

IPC: G06F1/16

Abstract: According to one aspect of the disclosure an electronic device comprises a foldable housing including: a hinge structure, a first housing structure connected to the hinge structure, and including a first face and a second face opposite the first face, and a second housing structure connected to the hinge structure and including a third face and a fourth face opposite the third face, the second housing structure being configured to be rotated about the hinge structure; a flexible display extending over the first face and over the third face; at least one sensor disposed within the foldable housing, and configured to sense an angle formed between the first face and the third face; a first haptic actuator disposed within the first housing structure; a second haptic actuator disposed within the second housing structure; at least one processor disposed within the first housing structure or the second housing structure, and operatively connected to the flexible display, the at least one sensor, the first haptic actuator, and the second haptic actuator. The at least one processor may detect a folding state of the foldable housing using the at least one sensor, and independently control the first haptic actuator and the second haptic actuator based on at least part of the detected folding state.

公开(公告)号：US20200314222A1

公开(公告)日：2020-10-01

申请号：US16829340

申请日：2020-03-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taewon KIM ,  Minsoo KIM ,  Bongsub KIM ,  Sangmin LEE ,  Jongheon LEE ,  Jiwoo LEE

IPC: H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  F21V8/00

Abstract: An electronic device including an indicator is provided. The electronic device includes a first housing structure including a first face oriented in a first direction, a second face oriented in a second direction opposite the first direction, and a first side member at least partially surrounding a space between the first face and the second face, a second housing structure including a third face oriented in a third direction, a fourth face oriented in a fourth direction opposite the third direction, and a second side member at least partially surrounding a space between the third face and the fourth face, a hinge structure rotatably connecting the first housing structure and the second housing structure to each other, the hinge structure configured to provide a folding axis that is a rotating center of the first housing structure and the second housing structure, a flexible display extending from the first face to the third face across the hinge structure, a hinge case disposed between the first housing structure and the second housing structure to accommodate the hinge structure therein to conceal or protect the hinge structure, and one or more first light-emitting elements disposed on an outer face of the hinge case. The electronic device may be configured to transmit light emitted from the one or more first light-emitting elements to outside of the electronic device.

公开(公告)号：US20240257862A1

公开(公告)日：2024-08-01

申请号：US18507615

申请日：2023-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeyun KIM ,  Junmyung WOO ,  Taewon KIM ,  Yanggyoon LOH

IPC: G11C11/4091 ,  G11C11/408 ,  G11C11/4094

CPC classification number: G11C11/4091 ,  G11C11/4087 ,  G11C11/4094

Abstract: An LSA circuit includes a first sensing transistor and a second sensing transistor connected in series between a local I/O line and a complementary local I/O line, a pre-sensing driver configured to drive an LSA sensing voltage to a connection node between the first sensing transistor and the second sensing transistor during a pre-sensing operation of the LSA circuit, and a main-sensing driver configured to drive the LSA sensing voltage to the connection node during a main-sensing operation of the LSA circuit. A driving strength of the pre-sensing driver is set to be weaker than a driving strength of the main-sensing driver, and the pre-sensing driver is driven before the main-sensing driver.

公开(公告)号：US20200326754A1

公开(公告)日：2020-10-15

申请号：US16847794

申请日：2020-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsoo KIM ,  Bongsub KIM ,  Taewon KIM ,  Sangmin LEE ,  Jongheon LEE ,  Jiwoo LEE

IPC: G06F1/16 ,  H04N5/225 ,  H04M1/02

Abstract: According to an embodiment of the disclosure, an electronic device comprises a first housing structure; and a second housing structure hingedly connected to the first housing structure along a hinge axis, wherein a first surface of the first housing structure faces a first surface of the second housing structure in a folded configuration of the electronic device, and the first surface of the first housing structure and the first surface of the second housing structure are planar in an unfolded configuration of the electronic device; a first display disposed on the first surface of the first housing structure and the first surface of the second housing structure, and bendable about the hinge axis; and a sliding structure retractably disposed in the first housing structure, configured to protrude to the outside of the first housing structure in a direction substantially co-planar to the first surface of the first housing structure, the sliding structure comprising at least one optical input module facing a direction substantially orthogonal to the first surface.

公开(公告)号：US20220295647A1

公开(公告)日：2022-09-15

申请号：US17824142

申请日：2022-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunho KIM ,  Jehyun SON ,  Taewon KIM

IPC: H05K5/00 ,  H01R12/75

Abstract: An electronic device is provided. The electronic device includes a display forming the front surface of the electronic device, a housing in which the display is seated and which at least forms a first side surface of the electronic device, an opening provided in the first side surface formed by the housing, a printed circuit board disposed adjacent to the first side surface, a connecting interface disposed on the PCB so as to be electrically connected to an external connector when the external connector is inserted through the opening, and a reinforcement member disposed on the PCB so as to surround the side surface of the connecting interface without covering the top surface of the connecting interface.

公开(公告)号：US20160100499A1

公开(公告)日：2016-04-07

申请号：US14876294

申请日：2015-10-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngjun JUNG ,  Taewon KIM ,  Eonseog CHEON ,  Junghee HWANG

IPC: H05K5/06 ,  G06F1/16

CPC classification number: H05K5/062 ,  G06F1/1656 ,  G06F1/1662 ,  G06F1/1671 ,  H01H13/06 ,  H01H2231/022 ,  H04M1/18 ,  H04M1/23

Abstract: An electronic device and a method of waterproofing a key thereof are provided. The electronic device includes a body, a display device disposed in the body, a key disposed in the body, and a key-waterproof structure including an insert-injected product that includes an insert-injected sealing area, and a bonding area where a silicon-not-attached portion is formed. The method includes assembling a flexible printed circuit board, to which a key is attached, through a silicon-not-attached portion of an insert-injected product, which is made by insert-injecting a bracket and silicon rubber, and bonding the silicon-not-attached portion.

Abstract translation: 提供一种电子设备及其密钥防水方法。 电子设备包括主体，设置在主体中的显示装置，设置在主体中的键，以及包括插入注入产品的键防水结构，其包括插入注入的密封区域，以及粘合区域，其中硅 不附加部分。 该方法包括通过嵌入式注入支架和硅橡胶制成的嵌入式注射产品的硅非附着部分组装安装有钥匙的柔性印刷电路板，并将硅 - 未附着部分。