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公开(公告)号：US11770897B2
公开(公告)日：2023-09-26
申请号：US17545374
申请日：2021-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsun Lee , Sungwon Park , Sunghyup Lee , Byeonguk Min
CPC classification number: H05K1/148 , H05K1/036 , H05K1/11 , H05K2201/0999 , H05K2201/10128
Abstract: A printed circuit board and an electronic device including the printed circuit board are provided. The electronic device includes a housing, and a printed circuit board located in an inner space of the housing, wherein the printed circuit board includes a component disposition area in which at least one component is disposed, a pre-forming area in which a plastic deformation material is laminated as a polymer material for inducing plastic deformation on a part of the printed circuit board, and a flexible area having flexible characteristics and on which the plastic deformation material is not laminated.
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公开(公告)号：US11439009B2
公开(公告)日：2022-09-06
申请号：US17118757
申请日：2020-12-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungwon Park
Abstract: Various embodiments relate to an apparatus. The apparatus may include: a first printed circuit board including a first ground layer having one or more openings formed therein and a wiring layer on which a signal wire is disposed; a second printed circuit board including a second ground layer having one or more openings formed therein; a first area and a third area in which the first printed circuit board and the second printed circuit board are connected to each other via an insulating layer; and a second area, which extends from the first area to the third area, and in which the first printed circuit board and the second printed circuit board are spaced apart from each other, with an air layer interposed therebetween. Various other embodiments may be possible.
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公开(公告)号：US12144109B2
公开(公告)日：2024-11-12
申请号：US17967532
申请日：2022-10-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsun Lee , Sungwon Park , Eunseok Hong
Abstract: A printed circuit board is provided. The printed circuit board includes: an extending region extending along one direction, and a bending region configured to bend with respect to the extending region. The extending region and the bending region includes a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and at least one via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. In the bending region, a cross-sectional area of the via hole in contact with the first conductive layer is less than a cross-sectional area of the via hole in contact with the second conductive layer.
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公开(公告)号：US11523507B2
公开(公告)日：2022-12-06
申请号：US17267651
申请日：2019-08-09
Applicant: Samsung Electronics Co., Ltd. , SI FLEX CO., LTD.
Inventor： Sungwon Park , Junghyub Kim , Hwanyoul Jeong , Seungyup Lee , Youngsun Lee , Hesuk Jung , Eunseok Hong
Abstract: Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments.
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Patent Agency Ranking
公开(公告)号：US20190269009A1
公开(公告)日：2019-08-29
申请号：US16284619
申请日：2019-02-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungwon Park , Seungyup Lee , Hesuk Jung
Abstract: An electronic device includes first printed circuit board (PCB) structure including first layer including first conductive strip, second conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, and third conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, such that first conductive strip is between second conductive strip and third conductive strip, and second layer including first conductive layer, first insulating layer interposed between and in contact with first region of first layer and first region of second layer facing first region of first layer, second insulating layer interposed between second region of first layer abutting first region of first layer and second region of second layer abutting first region of second layer while contacting first layer, and third insulating layer interposed between second insulating layer and second region of second layer, while contacting second layer, and being separated from second insulating layer by air gap, and a wireless communication circuit electrically connected to first conductive strip and configured to transmit and/or receive radio frequency (RF) signal.
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公开(公告)号：US11848500B2
公开(公告)日：2023-12-19
申请号：US16941643
申请日：2020-07-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghwan Yeom , Youngjong Kim , Sungwon Park , Handug Lee , Jongwoo Choi
CPC classification number: H01Q21/065 , H01Q1/243 , H01Q21/0025
Abstract: Disclosed is an electronic device. The electronic device includes: a housing including at least a part of a lateral surface of the electronic device; a printed circuit board (PCB) disposed in the housing; at least one wireless communication circuit disposed on the PCB; a first antenna module including at least one antenna disposed in a first region inside the housing; a second antenna module including at least one antenna disposed in a second region inside the housing; a third antenna module including at least one antenna disposed in a third region inside the housing; a first flexible printed circuit board (FPCB) connecting the first antenna module to the at least one wireless communication circuit; and a second FPCB connecting the second antenna module and the third antenna module to the at least one wireless communication circuit. The second FPCB includes: a first connector disposed on the PCB and electrically connected to the wireless communication circuit; a second connector coupled to a second joint electrically connected to the second antenna module; a third connector coupled to a third joint electrically connected to the third antenna module; and a coupler connecting the first connector, the second connector, and the third connector.
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公开(公告)号：US11605891B2
公开(公告)日：2023-03-14
申请号：US16460937
申请日：2019-07-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungwon Park , Dongil Son , Sangwon Ha
Abstract: An electronic device includes a communication circuit electrically connected with a circuit board. The circuit board includes a first portion comprising a first layered structure in which a wiring layer and a first insulating layer are alternately positioned, and a second portion comprising a second layered structure in which the wiring layer and the first insulating layer are alternately positioned and a second insulating layer. At least one antenna patch is positioned on or within the second insulating layer. A conductive line penetrates the second layered structure and the second insulating layer and electrically connects the at least one antenna patch and the communication circuit. The first insulating layer has a first loss tangent value, and the second insulating layer has a second loss tangent value smaller than the first loss tangent value.
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公开(公告)号：US11425243B2
公开(公告)日：2022-08-23
申请号：US17266894
申请日：2019-08-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jinki Jung , Sungwon Park , Jaein Yoo , Yongkoo Lee
Abstract: An electronic device according to various embodiments may comprise a communication module, a display, an output device, and a processor, wherein the processor is configured to: in response to the reception of a call signal through the communication module, identify a caller corresponding to the call signal; identify a first photo on the basis of the caller; when the electronic device has been configured to output sound in response to the reception of the call signal, output an incoming call screen generated on the basis of the first photo to at least part of the display, wherein the incoming call screen includes one or more image components, each having at least one display attribute that changes according to a change of the sound characteristics of a ringtone; and output the ringtone through the output device while outputting the incoming call screen. Various other embodiments are also possible.
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公开(公告)号：US10827607B2
公开(公告)日：2020-11-03
申请号：US16284619
申请日：2019-02-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungwon Park , Seungyup Lee , Hesuk Jung
Abstract: An electronic device includes first printed circuit board (PCB) structure including first layer including first conductive strip, second conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, and third conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, such that first conductive strip is between second conductive strip and third conductive strip, and second layer including first conductive layer, first insulating layer interposed between and in contact with first region of first layer and first region of second layer facing first region of first layer, second insulating layer interposed between second region of first layer abutting first region of first layer and second region of second layer abutting first region of second layer while contacting first layer, and third insulating layer interposed between second insulating layer and second region of second layer, while contacting second layer, and being separated from second insulating layer by air gap, and a wireless communication circuit electrically connected to first conductive strip and configured to transmit and/or receive radio frequency (RF) signal.
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