公开(公告)号：US11770897B2

公开(公告)日：2023-09-26

申请号：US17545374

申请日：2021-12-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsun Lee ,  Sungwon Park ,  Sunghyup Lee ,  Byeonguk Min

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/148 ,  H05K1/036 ,  H05K1/11 ,  H05K2201/0999 ,  H05K2201/10128

Abstract: A printed circuit board and an electronic device including the printed circuit board are provided. The electronic device includes a housing, and a printed circuit board located in an inner space of the housing, wherein the printed circuit board includes a component disposition area in which at least one component is disposed, a pre-forming area in which a plastic deformation material is laminated as a polymer material for inducing plastic deformation on a part of the printed circuit board, and a flexible area having flexible characteristics and on which the plastic deformation material is not laminated.