公开(公告)号：US20200043884A1

公开(公告)日：2020-02-06

申请号：US16268651

申请日：2019-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JOON-HO LEE ,  Sung-Hyup Kim ,  Ki-Ju Sohn

IPC: H01L23/00 ,  H01L21/67 ,  H01J37/32 ,  H01L25/00 ,  H01L25/18 ,  H01L27/146 ,  H01L21/68 ,  H01L23/544

Abstract: A wafer to wafer bonding method includes performing a plasma process on a bonding surface of a first wafer, pressurizing the first wafer after performing the plasma process on the bonding surface of the first wafer, and bonding the first wafer to a second wafer. The plasma process has different plasma densities along a circumferential direction about a center of the first wafer. A middle portion of the first wafer protrudes after pressurizing the first wafer. The first wafer is bonded to the second wafer by gradually joining the first wafer to the second wafer from the middle portion of the first wafer to a peripheral region of the first wafer.

公开(公告)号：US10937670B2

公开(公告)日：2021-03-02

申请号：US15870456

申请日：2018-01-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Yong Park ,  Sung-Hyup Kim ,  Sung-Gwang Lee ,  Kwang-Sung Lee

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/12

Abstract: A megasonic cleaner includes a water tank that includes a pair of opposite inner walls and a bottom wall connected thereto, and that accommodates a fluid therein; a plurality of supporting units arranged in the water tank at predetermined positions that support a wafer; and at least one transducer arranged on the bottom wall that transmits energy in the form of waves into the fluid, where each of the opposite inner walls has a first protrusion that protrudes into an internal space of the water tank, the first protrusion being spaced above the bottom wall and positioned at an height that is greater than or equal to a height of the centers of the plurality of supporting units.

公开(公告)号：US10811381B2

公开(公告)日：2020-10-20

申请号：US16268651

申请日：2019-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joon-Ho Lee ,  Sung-Hyup Kim ,  Ki-Ju Sohn

IPC: H01L21/68 ,  H01L23/00 ,  H01L21/67 ,  H01J37/32 ,  H01L25/00 ,  H01L25/18 ,  H01L27/146 ,  H01L23/544 ,  H01L29/04 ,  H01L21/683

Abstract: A wafer to wafer bonding method includes performing a plasma process on a bonding surface of a first wafer, pressurizing the first wafer after performing the plasma process on the bonding surface of the first wafer, and bonding the first wafer to a second wafer. The plasma process has different plasma densities along a circumferential direction about a center of the first wafer. A middle portion of the first wafer protrudes after pressurizing the first wafer. The first wafer is bonded to the second wafer by gradually joining the first wafer to the second wafer from the middle portion of the first wafer to a peripheral region of the first wafer.

公开(公告)号：US10763243B2

公开(公告)日：2020-09-01

申请号：US16135122

申请日：2018-09-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-Hyung Kim ,  Sung-Hyup Kim ,  Kyeong-Bin Lim ,  Seok-Ho Kim ,  Tae-Yeong Kim

IPC: H01L25/065 ,  H01L21/67 ,  H01L25/00 ,  H01L21/66 ,  H01L21/687 ,  H01L21/68

Abstract: A substrate bonding apparatus and a method of bonding substrates, the apparatus including an upper chuck securing a first substrate onto a lower surface thereof such that the first substrate is downwardly deformed into a concave surface profile; a lower chuck arranged under the upper chuck and securing a second substrate onto an upper surface thereof such that the second substrate is upwardly deformed into a convex surface profile; and a chuck controller controlling the upper chuck and the lower chuck to secure the first substrate and the second substrate, respectively, and generating a shape parameter for changing a shape of the second substrate to the convex surface profile from a flat surface profile.

公开(公告)号：US11640912B2

公开(公告)日：2023-05-02

申请号：US16507407

申请日：2019-07-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-Hyung Kim ,  Sung-Hyup Kim ,  Tae-Yeong Kim

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/687 ,  H01L21/673 ,  H01L25/00

Abstract: A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.

公开(公告)号：US10811287B2

公开(公告)日：2020-10-20

申请号：US16128990

申请日：2018-09-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-Joo Jeon ,  Sung-Hyup Kim

IPC: H01L21/67 ,  B05C11/08 ,  H01L21/687 ,  B05C13/02

Abstract: A spin coater includes a rotatable chuck structure configured to hold a substrate, a bowl enclosing the substrate and guiding a flow of a fluid around the substrate to a bottom of the bowl, and a flow controller detachably coupled to the bowl such that the flow controller is arranged between the bowl and an edge of the substrate and separates the flow into a linear flow and a non-linear flow.

公开(公告)号：US10295564B2

公开(公告)日：2019-05-21

申请号：US15407660

申请日：2017-01-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Yong Park ,  Sang-Boo Kang ,  Jae-Geun Kim ,  Sung-Hyup Kim ,  Jeong-Min Na ,  Jae-Hyoung Park ,  Sang-Kyu Yoo ,  Jae-Hoon Joo

IPC: G01R1/073 ,  G01R1/04 ,  G01R31/28

Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.

公开(公告)号：US20190013218A1

公开(公告)日：2019-01-10

申请号：US15870456

申请日：2018-01-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Yong Park ,  Sung-Hyup Kim ,  Sung-Gwang Lee ,  Kwang-Sung Lee

IPC: H01L21/67 ,  H01L21/02

Abstract: A megasonic cleaner includes a water tank that includes a pair of opposite inner walls and a bottom wall connected thereto, and that accommodates a fluid therein; a plurality of supporting units arranged in the water tank at predetermined positions that support a wafer; and at least one transducer arranged on the bottom wall that transmits energy in the form of waves into the fluid, where each of the opposite inner walls has a first protrusion that protrudes into an internal space of the water tank, the first protrusion being spaced above the bottom wall and positioned at an height that is greater than or equal to a height of the centers of the plurality of supporting units.