Abstract:
In a memory system including a flash memory and a memory controller having a cache memory and a nonvolatile random access memory (NVRAM), a method of operating the memory system includes; receiving a write request specifying a write operation directed to a page of a designated active write block in the flash memory, storing a page mapping table for the active write block in the cache memory, generating update information for the page mapping table stored in the cache memory as a result of executing the write operation, and storing the update information in the NVRAM, and storing an updated version of the page mapping table in the flash memory after execution of the write operation is complete.
Abstract:
An operating method of a memory controller, configured to control a non-volatile memory device that performs a refresh read operation, detects a power on state or power off state of the non-volatile memory device and issues a refresh read command. The non-volatile memory device that receives the refresh read command is controlled to perform, one time, the refresh read operation including a read operation on one of a plurality of word lines with respect to each of the plurality of memory blocks.
Abstract:
A memory system includes nonvolatile memory devices (NVM) connected to a controller via a channel and provided with data according to an interleaving approach. A controller respectively accesses the NVM and determines a number of program operations that may be simultaneously executed by the NVM in conjunction with an additional operation upon comparing a peak operating current associated with a sum of respective peak operating currents for the number of program operations and the at least one additional operation with a reference peak current.
Abstract:
A wafer to wafer bonding method includes performing a plasma process on a bonding surface of a first wafer, pressurizing the first wafer after performing the plasma process on the bonding surface of the first wafer, and bonding the first wafer to a second wafer. The plasma process has different plasma densities along a circumferential direction about a center of the first wafer. A middle portion of the first wafer protrudes after pressurizing the first wafer. The first wafer is bonded to the second wafer by gradually joining the first wafer to the second wafer from the middle portion of the first wafer to a peripheral region of the first wafer.
Abstract:
A nonvolatile memory device comprises a first area of single-level cells (SLCs) and a second area of multi-level cells (MLCs). The device determines whether a free block can be created by copying data between memory blocks of the first area. Upon determining that the free memory block can be created by copying data between the memory blocks of the first area, the device copies the data between the memory blocks of the first area to create the free memory block. Otherwise, the device selects at least one memory block from the first area and allocates the selected memory block as free memory block by copying the data stored in the selected memory block of the first area to the second area.