公开(公告)号：US20240136232A1

公开(公告)日：2024-04-25

申请号：US18202650

申请日：2023-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inkeun BAEK ,  Suhwan PARK ,  Ikseon JEON ,  Namil KOO ,  Ingi KIM ,  Jaeho KIM ,  Junbum PARK ,  Sunhong JUN

IPC: H01L21/66 ,  G01N21/95

CPC classification number: H01L22/12 ,  G01N21/9501

Abstract: Provided is a method of extracting properties of a layer on a wafer, the method including emitting electromagnetic waves to a lower surface of the wafer, detecting a first electromagnetic wave, that passes through a target layer on an upper surface of the wafer, and a second electromagnetic wave, that is reflected from the target layer, among the electromagnetic waves to obtain data including information about the first electromagnetic wave and the second electromagnetic wave, and separating a first pulse of the first electromagnetic wave and a second pulse of the second electromagnetic wave from each other in the data and obtaining property data of the target layer.

公开(公告)号：US20240234216A9

公开(公告)日：2024-07-11

申请号：US18202650

申请日：2023-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inkeun BAEK ,  Suhwan PARK ,  Ikseon JEON ,  Namil KOO ,  Ingi KIM ,  Jaeho KIM ,  Junbum PARK ,  Sunhong JUN

IPC: H01L21/66 ,  G01N21/95

CPC classification number: H01L22/12 ,  G01N21/9501

Abstract: Provided is a method of extracting properties of a layer on a wafer, the method including emitting electromagnetic waves to a lower surface of the wafer, detecting a first electromagnetic wave, that passes through a target layer on an upper surface of the wafer, and a second electromagnetic wave, that is reflected from the target layer, among the electromagnetic waves to obtain data including information about the first electromagnetic wave and the second electromagnetic wave, and separating a first pulse of the first electromagnetic wave and a second pulse of the second electromagnetic wave from each other in the data and obtaining property data of the target layer.

公开(公告)号：US20220082584A1

公开(公告)日：2022-03-17

申请号：US17333924

申请日：2021-05-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongmin YOON ,  Namil KOO ,  Nagel MICHAEL ,  Suhwan PARK ,  Junbum PARK ,  Inkeun BAEK ,  Sion LEE

IPC: G01Q60/22 ,  H05K9/00

Abstract: A near-field detection system includes include an electric field generator configured to apply an electric field to an analysis sample, a probe configured to detect a near field that has passed through the analysis sample, a current detector connected to the probe, and a laser system irradiating a laser to each of the electric field generator and the probe. The probe includes a cantilever substrate, an antenna electrode on the cantilever substrate, an electromagnetic wave blocking layer exposing a sensing region of the cantilever substrate, the electromagnetic wave blocking layer including a conductive material, and an insulating layer interposed between the cantilever substrate and the electromagnetic wave blocking layer such that the insulating layer is between the antenna electrode and the electromagnetic wave blocking layer.

公开(公告)号：US20240152058A1

公开(公告)日：2024-05-09

申请号：US18337982

申请日：2023-06-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonki LEE ,  Hyoungsoo KIM ,  Junill RYU ,  Namil KOO ,  Jongmin YOON ,  Suhwan PARK ,  Sangyeon OH ,  Gilgu LEE

IPC: G03F7/00

CPC classification number: G03F7/70341 ,  G03F7/70883

Abstract: An immersion lithographic system may include a wafer stage configured to support a wafer, a projection optical system on the wafer stage and configured to irradiate light toward the wafer, a liquid supply unit configured to supply a liquid between the wafer stage and the projection optical system to form an immersion lens through which the light is transmitted, and a vapor supply unit configured to supply vapors to the immersion lens. The immersion lens and the vapor supply unit may be aligned in a vertical direction.

公开(公告)号：US20210366102A1

公开(公告)日：2021-11-25

申请号：US17102700

申请日：2020-11-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suhwan PARK ,  Namil Koo ,  Taeheung Ahn ,  Kwangjun Yoon ,  Jongmin Yoon ,  Ikseon Jeon ,  Jimin Choi

IPC: G06T7/00 ,  G01N21/95 ,  G01N21/956 ,  G06K9/46 ,  G06T7/13 ,  G06T7/70 ,  H01L21/67

Abstract: An inspection apparatus includes a measurement device disposed to be spaced apart from an upper surface of a wafer, an image capturing device configured to capture an image of at least a portion of the measurement device and at least a portion of the upper surface of the wafer, a memory storing an algorithm to measure a distance between the measurement device and the upper surface of the wafer based on the image, and a controller configured to measure the distance between the measurement device and the upper surface of the wafer based on the algorithm, wherein the image includes a measurement region in which the measurement device is displayed, a wafer region in which the wafer is displayed, and a reflective region in which the measurement device being reflected on the upper surface of the wafer is displayed, and wherein the wafer region and the reflective region overlap with each other.

公开(公告)号：US20220037215A1

公开(公告)日：2022-02-03

申请号：US17180343

申请日：2021-02-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inkeun BAEK ,  Namil KOO ,  Suhwan PARK ,  Junbum PARK

IPC: H01L21/66 ,  H01L21/683

Abstract: A semiconductor substrate processing apparatus includes: a metastructure layer divided into a plurality of microstructures by grooves, a light-transmitting dielectric substrate that supports the plurality of microstructures and is configured to allow an electromagnetic wave to be transmitted therethrough, and a frame including an exhaust hole configured to receive gas introduced from the grooves such as to provide suction force to the semiconductor substrate, wherein each of the plurality of microstructures has a smaller width than a wavelength of the electromagnetic wave, and each of the grooves has a smaller width than the wavelength of the electromagnetic wave.

公开(公告)号：US20210057262A1

公开(公告)日：2021-02-25

申请号：US16834132

申请日：2020-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Racine Elysia Auxter NASSAU ,  Namil KOO ,  Suhwan PARK ,  Taeheung AHN ,  Sangyeon OH

IPC: H01L21/683 ,  H01L21/687 ,  G01N21/95

Abstract: A wafer inspection apparatus includes a support structure including a frame and vacuum chucks mounted thereon, each vacuum chuck having a support surface including a vacuum suction portion, the support structure configured to structurally support a wafer on one or more vacuum chucks, the frame defining an opening larger than an area of the wafer. The wafer inspection apparatus includes an electromagnetic wave emitter configured to irradiate an inspection electromagnetic wave to the wafer, a sensor configured to receive the inspection electromagnetic wave from the wafer based on the inspection electromagnetic wave passing through the wafer, and a driver configured to move at least one of the electromagnetic wave emitter or the frame to change an irradiation location of the wafer. Each vacuum chuck is configured to be selectively movable between a first location and a second location in relation to the frame.