公开(公告)号：US20210366102A1

公开(公告)日：2021-11-25

申请号：US17102700

申请日：2020-11-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suhwan PARK ,  Namil Koo ,  Taeheung Ahn ,  Kwangjun Yoon ,  Jongmin Yoon ,  Ikseon Jeon ,  Jimin Choi

IPC: G06T7/00 ,  G01N21/95 ,  G01N21/956 ,  G06K9/46 ,  G06T7/13 ,  G06T7/70 ,  H01L21/67

Abstract: An inspection apparatus includes a measurement device disposed to be spaced apart from an upper surface of a wafer, an image capturing device configured to capture an image of at least a portion of the measurement device and at least a portion of the upper surface of the wafer, a memory storing an algorithm to measure a distance between the measurement device and the upper surface of the wafer based on the image, and a controller configured to measure the distance between the measurement device and the upper surface of the wafer based on the algorithm, wherein the image includes a measurement region in which the measurement device is displayed, a wafer region in which the wafer is displayed, and a reflective region in which the measurement device being reflected on the upper surface of the wafer is displayed, and wherein the wafer region and the reflective region overlap with each other.