FIELD EFFECT TRANSISTOR AND INTEGRATED CIRCUIT DEVICE INCLUDING THE SAME

    公开(公告)号:US20240079498A1

    公开(公告)日:2024-03-07

    申请号:US18236623

    申请日:2023-08-22

    CPC classification number: H01L29/7869 H10B12/315 H10B12/482 H10B12/488

    Abstract: Provided is a field effect transistor including a gate electrode layer, an oxide semiconductor layer including gallium (Ga) and at least one metal element selected from indium (In) and zinc (Zn), and a dielectric layer between the gate electrode layer and the oxide semiconductor layer, wherein the oxide semiconductor layer includes a sub semiconductor layer in contact with the dielectric layer and a main semiconductor layer spaced apart from the dielectric layer with the sub semiconductor layer therebetween, the sub semiconductor layer has a first Ga content, and the first Ga content of the sub semiconductor layer is greater than contents of other metal elements included in the sub semiconductor layer and decreases as a distance from an interface of the sub semiconductor layer in contact with the dielectric layer increases.

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20230352297A1

    公开(公告)日:2023-11-02

    申请号:US18183571

    申请日:2023-03-14

    CPC classification number: H01L21/02194 H01L21/02205

    Abstract: A method of manufacturing a semiconductor device including providing a first precursor on a substrate to adsorb a first element of the first precursor onto a first region of the substrate, providing a second precursor on the substrate to adsorb a second element of the second precursor onto a second region of the substrate, the second region being different from the first region, and providing a reactant including oxygen on the substrate to form an oxide semiconductor layer including the first element of the first precursor, the second element of the second precursor, and the oxygen of the reactant may be provided.

    Depth camera, multi-depth camera system and method of synchronizing the same
    4.
    发明授权
    Depth camera, multi-depth camera system and method of synchronizing the same 有权
    深度摄像机,多摄像机系统及其同步方法

    公开(公告)号:US09253471B2

    公开(公告)日:2016-02-02

    申请号:US13767521

    申请日:2013-02-14

    Abstract: A depth camera includes a sensor unit receiving a reflected light and in response thereto outputting an electrical sensing signal; and a synchronization information calculation unit calculating a performance index with reference to the sensing signal, and with reference to the performance index, generating synchronization information for synchronizing a demodulation clock for sensing the received reflected light. The sensor unit adjusts the frequency and/or phase of the demodulation clock with reference to the synchronization information.

    Abstract translation: 深度照相机包括接收反射光的传感器单元,并且响应于此输出电感测信号; 以及同步信息计算单元,参考感测信号来计算性能指标,并且参考性能指标,产生用于同步用于感测所接收的反射光的解调时钟的同步信息。 传感器单元参照同步信息调整解调时钟的频率和/或相位。

    SEMICONDUCTOR DEVICE
    7.
    发明公开

    公开(公告)号:US20240074148A1

    公开(公告)日:2024-02-29

    申请号:US18230916

    申请日:2023-08-07

    CPC classification number: H10B12/315 H10B12/05 H10B12/50

    Abstract: A semiconductor device includes a plurality of bit lines arranged on a substrate and extending in a first horizontal direction, a mold insulating layer arranged on the bit lines and including a plurality of openings extending in a second horizontal direction, respectively, a plurality of channel layers respectively arranged on the bit lines and including a first vertical extension portion, in each opening of the mold insulating layer, a plurality of passivation layers respectively arranged on each vertical extension portion, a gate insulating layer arranged to face each vertical extension portion with each passivation layer therebetween, and a plurality of word lines extending in the second horizontal direction on the gate insulating layer and including first word lines respectively arranged on a first sidewall of each opening of the mold insulating layer and second word lines respectively arranged on a second sidewall of each opening of the mold insulating layer.

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