Abstract:
A semiconductor device has, in a gate insulating layer, in an XPS spectrum of O 1s obtained by an X-ray photoelectron spectroscopy (XPS) using a monochromatic aluminum Kα (1486.6 eV) source, a ratio (%) of an Al—O peak observed in a binding energy of about 530.3 eV to about 531.6 eV to all peaks of greater than or equal to about 80%.
Abstract:
Provided is a field effect transistor including a gate electrode layer, an oxide semiconductor layer including gallium (Ga) and at least one metal element selected from indium (In) and zinc (Zn), and a dielectric layer between the gate electrode layer and the oxide semiconductor layer, wherein the oxide semiconductor layer includes a sub semiconductor layer in contact with the dielectric layer and a main semiconductor layer spaced apart from the dielectric layer with the sub semiconductor layer therebetween, the sub semiconductor layer has a first Ga content, and the first Ga content of the sub semiconductor layer is greater than contents of other metal elements included in the sub semiconductor layer and decreases as a distance from an interface of the sub semiconductor layer in contact with the dielectric layer increases.
Abstract:
A method of manufacturing a semiconductor device including providing a first precursor on a substrate to adsorb a first element of the first precursor onto a first region of the substrate, providing a second precursor on the substrate to adsorb a second element of the second precursor onto a second region of the substrate, the second region being different from the first region, and providing a reactant including oxygen on the substrate to form an oxide semiconductor layer including the first element of the first precursor, the second element of the second precursor, and the oxygen of the reactant may be provided.
Abstract:
A depth camera includes a sensor unit receiving a reflected light and in response thereto outputting an electrical sensing signal; and a synchronization information calculation unit calculating a performance index with reference to the sensing signal, and with reference to the performance index, generating synchronization information for synchronizing a demodulation clock for sensing the received reflected light. The sensor unit adjusts the frequency and/or phase of the demodulation clock with reference to the synchronization information.
Abstract:
An apparatus for cleaning an EUV light creation chamber may include a cleaning module, a first movement module and a second movement module. The first movement module may support the cleaning module in the EUV light creation chamber along a first direction. The second movement module may support the first movement module on a surface of the EUV light creation chamber at a position along a second direction perpendicular to the first direction.
Abstract:
The semiconductor device may include a bit line on a substrate, a gate electrode on the bit line, a gate insulation pattern on a sidewall of the gate electrode, a first channel contacting an upper surface of the bit line and the sidewall of the gate insulation pattern and a contact plug contacting an upper surface of the first channel. The first channel may include a spinel IGZO.
Abstract:
A semiconductor device includes a plurality of bit lines arranged on a substrate and extending in a first horizontal direction, a mold insulating layer arranged on the bit lines and including a plurality of openings extending in a second horizontal direction, respectively, a plurality of channel layers respectively arranged on the bit lines and including a first vertical extension portion, in each opening of the mold insulating layer, a plurality of passivation layers respectively arranged on each vertical extension portion, a gate insulating layer arranged to face each vertical extension portion with each passivation layer therebetween, and a plurality of word lines extending in the second horizontal direction on the gate insulating layer and including first word lines respectively arranged on a first sidewall of each opening of the mold insulating layer and second word lines respectively arranged on a second sidewall of each opening of the mold insulating layer.