SEMICONDUCTOR DEVICE
    1.
    发明申请

    公开(公告)号:US20250107065A1

    公开(公告)日:2025-03-27

    申请号:US18619490

    申请日:2024-03-28

    Abstract: A semiconductor device includes a semiconductor pattern, a dielectric layer on the semiconductor pattern, and a conductive pattern on the dielectric layer. Each of the semiconductor pattern and the dielectric layer includes impurities. The dielectric layer includes a concentration profile of impurities including a first variation section including a first concentration of impurities decreasing throughout the dielectric layer toward the semiconductor pattern, and a second variation section including a second concentration of impurities decreasing throughout the dielectric layer toward the semiconductor pattern.

    FIELD-EFFECT TRANSISTOR AND INTEGRATED CIRCUIT DEVICE INCLUDING THE SAME

    公开(公告)号:US20240224510A1

    公开(公告)日:2024-07-04

    申请号:US18354041

    申请日:2023-07-18

    CPC classification number: H10B12/485 H10B12/315 H10B12/34

    Abstract: A field-effect transistor includes an insulating barrier layer on a substrate, a gate electrode extending on the insulating barrier layer, a gate insulating layer covering opposite side surfaces and a top surface of the gate electrode, an oxide semiconductor layer on the gate insulating layer and including at least one metal element selected from indium (In) and zinc (Zn), and a source structure and a drain structure separated from each other, the source structure and the drain structure electrically connected to the oxide semiconductor layer. Each of the source structure and the drain structure includes an indium gallium tin oxide (IGTO) film on the oxide semiconductor layer, a conductive metal nitride film on the IGTO film, one of a source electrode and a drain electrode on the conductive metal nitride film, and a top capping layer on a top surface of one of the source electrode and the drain electrode.

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