METHOD OF FABRICATING SEMICONDUCTOR DEVICE

    公开(公告)号:US20220149210A1

    公开(公告)日:2022-05-12

    申请号:US17584545

    申请日:2022-01-26

    Abstract: A semiconductor device includes a channel pattern including first and second semiconductor patterns stacked on a substrate, a gate electrode covering top and lateral surfaces of the channel pattern and extending in a first direction, and including a first gate segment between the first semiconductor pattern and the second semiconductor pattern, a gate spacer covering a lateral surface of the gate electrode and including an opening exposing the channel pattern, and a first source/drain pattern on a side of the gate spacer and in contact with the channel pattern through the opening, the first source/drain pattern including a sidewall center thickness at a height of the first gate segment and at a center of the opening, and a sidewall edge thickness at the height of the first gate segment and at an edge of the opening, the sidewall edge thickness being about 0.7 to 1 times the sidewall center thickness.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20200381564A1

    公开(公告)日:2020-12-03

    申请号:US16774653

    申请日:2020-01-28

    Abstract: A semiconductor device includes a channel pattern including first and second semiconductor patterns stacked on a substrate, a gate electrode covering top and lateral surfaces of the channel pattern and extending in a first direction, and including a first gate segment between the first semiconductor pattern and the second semiconductor pattern, a gate spacer covering a lateral surface of the gate electrode and including an opening exposing the channel pattern, and a first source/drain pattern on a side of the gate spacer and in contact with the channel pattern through the opening, the first source/drain pattern including a sidewall center thickness at a height of the first gate segment and at a center of the opening, and a sidewall edge thickness at the height of the first gate segment and at an edge of the opening, the sidewall edge thickness being about 0.7 to 1 times the sidewall center thickness.

    SEMICONDUCTOR DEVICE
    4.
    发明申请

    公开(公告)号:US20210408300A1

    公开(公告)日:2021-12-30

    申请号:US17470341

    申请日:2021-09-09

    Abstract: A semiconductor device includes a fin-type pattern on a substrate, the fin-type pattern extending in a first direction and protruding from the substrate in a third direction, a first wire pattern on the fin-type pattern, the first wire pattern being spaced apart from the fin-type pattern in the third direction, and a gate electrode extending in a second direction, which is perpendicular to the first and third directions, and surrounding the first wire pattern, the gate electrode including a first portion that overlaps with the fin-type pattern in the second direction and a second portion corresponding to a remainder of the gate electrode except for the first portion.

    ACCESSORY DEVICE FOR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    ACCESSORY DEVICE FOR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    用于电子设备的附件装置及其制造方法

    公开(公告)号:US20170049000A1

    公开(公告)日:2017-02-16

    申请号:US15206392

    申请日:2016-07-11

    Abstract: An accessory device comprising: a first cover arranged to be opened and closed when the first cover is mounted on an electronic device, the first cover comprising a first plate, at least one first side wall protruding from the first plate in a first direction, and a first film disposed in a space defined by the sidewall and the plate, wherein the first film and the first side wall are at least partially transparent, and wherein the first film comprises a first layer disposed on the first plate, the first layer being at least partially reflective, a second layer disposed on the first layer, the second layer being at least partially formed of a polymeric material, and a third layer that is disposed on the second layer, the third layer being an anti-wear layer.

    Abstract translation: 一种附件装置,包括:第一盖,其布置成当所述第一盖安装在电子装置上时被打开和关闭,所述第一盖包括第一板,在第一方向上从所述第一板突出的至少一个第一侧壁,以及 设置在由所述侧壁和所述板限定的空间中的第一膜,其中所述第一膜和所述第一侧壁至少部分透明,并且其中所述第一膜包括设置在所述第一板上的第一层,所述第一层位于 至少部分反射的,设置在第一层上的第二层,第二层至少部分地由聚合物材料形成,第三层设置在第二层上,第三层是耐磨层。

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