公开(公告)号：US20250098036A1

公开(公告)日：2025-03-20

申请号：US18427998

申请日：2024-01-31

Applicant: BOBOO HI-TECH CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun Hwi Park ,  Jin Yeol Wang ,  Yong Seok Choi ,  Ji Ho Uh ,  Seung Min Ryu ,  Do Youn Kim ,  Yoon Ho Jung

IPC: H05B3/28 ,  H01L21/683 ,  H05B3/00

Abstract: The present invention relates to a method for manufacturing an electrostatic chuck, and more specifically, to a method for manufacturing an electrostatic chuck with minimized temperature deviation. The method of the present invention includes: a step S10 of forming a metal layer by depositing metal on a lower portion of a base containing a ceramic material and provided with an ESC electrode at an upper portion thereof; and a step S20 of forming a heater electrode by forming a pattern on the metal layer using a photolithography process.

公开(公告)号：US09263414B2

公开(公告)日：2016-02-16

申请号：US14108961

申请日：2013-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeong Min Yeo ,  Seung Min Ryu ,  Dae Jung Kim ,  Ji Ho Uh ,  Suk Won Lee

IPC: H01L21/44 ,  H01L23/00 ,  H05K3/34 ,  B23K1/00 ,  B23K1/20

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/203 ,  H01L24/13 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/7501 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81815 ,  H05K3/3489 ,  H05K2203/0108 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.

Abstract translation: 可以提供倒装芯片封装方法和用于倒装芯片封装方法的磁头制造方法。 特别地，一种倒装芯片封装方法，包括在印刷电路板（PCB）的焊盘上印刷焊剂，以倒装芯片方式将裸片安装在PCB上，使得裸片的凸块面对PCB的焊盘， 可以提供使用焊剂将管芯的焊盘凸起到PCB的焊盘。