Semiconductor package
    1.
    发明授权

    公开(公告)号:US11557534B2

    公开(公告)日:2023-01-17

    申请号:US17390109

    申请日:2021-07-30

    Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and a first encapsulant covering at least a portion of each of the inactive surface and a side surface of the semiconductor chip. A metal layer is disposed on the first encapsulant, and includes a first conductive layer and a second conductive layer, sequentially stacked. A connection structure is disposed on the active surface of the semiconductor chip, and includes a first redistribution layer electrically connected to the connection pad. A lower surface of the first conductive layer is in contact with the first encapsulant and has first surface roughness, and an upper surface of the first conductive layer is in contact with the second conductive layer and has second surface roughness smaller than the first surface roughness.

    Semiconductor package
    2.
    发明授权

    公开(公告)号:US11107762B2

    公开(公告)日:2021-08-31

    申请号:US16662404

    申请日:2019-10-24

    Abstract: A semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and a first encapsulant covering at least a portion of each of the inactive surface and a side surface of the semiconductor chip. A metal layer is disposed on the first encapsulant, and includes a first conductive layer and a second conductive layer, sequentially stacked. A connection structure is disposed on the active surface of the semiconductor chip, and includes a first redistribution layer electrically connected to the connection pad. A lower surface of the first conductive layer is in contact with the first encapsulant and has first surface roughness, and an upper surface of the first conductive layer is in contact with the second conductive layer and has second surface roughness smaller than the first surface roughness.

    Display apparatus
    4.
    发明授权

    公开(公告)号:US10942391B2

    公开(公告)日:2021-03-09

    申请号:US16659896

    申请日:2019-10-22

    Abstract: There is provided a display apparatus with an improved viewing angle. The display apparatus includes a display panel configured to receive light from a light source module, wherein the display panel includes: a liquid crystal panel; a first polarizing plate positioned on a rear side of the liquid crystal panel and a second polarizing plate positioned on a front side of the liquid crystal panel; and an optical layer positioned on a front surface of the second polarizing plate, wherein the optical layer includes: a resin layer having a first refractive index, and including an accommodating groove in which a light adjusting portion is disposed, the resin layer further including a light refractive pattern protruding toward a rear direction of the display panel; and an adhesive layer having a second refractive index different from the first refractive index, and bonding the resin layer with the second polarizing plate.

    Display apparatus and back light unit included therein

    公开(公告)号:US10330836B2

    公开(公告)日:2019-06-25

    申请号:US15372795

    申请日:2016-12-08

    Abstract: A display apparatus may include a back light unit including a light source and a selective light absorption sheet configured to absorb light of a predetermined wavelength range among light emitted from the light source and an image forming unit configured to transmit or block light emitted from the back light unit to form an image. The selective light absorption sheet may include a selective light absorption film configured to absorb light of a predetermined wavelength range among light emitted from the light source, at least one light blocking film configured to absorb at least one of UV light and IR light, and at least one barrier film configured to block at least one of oxygen and moisture.

    SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD

    公开(公告)号:US20250167087A1

    公开(公告)日:2025-05-22

    申请号:US18775998

    申请日:2024-07-17

    Abstract: A semiconductor package includes a wiring substrate that includes a wiring pattern, a dielectric pattern that covers the wiring pattern, a substrate pad on the dielectric pattern and including a recess that extends from a top surface of the substrate pad toward an inside of the substrate pad, a metal layer on a bottom surface of the recess and spaced apart from an inner lateral surface of the recess, and a protection layer on the dielectric pattern and covering the substrate pad. The substrate pad penetrates the dielectric pattern to come into connection with the wiring pattern. The protection layer exposes at least a portion of the metal layer. The protection layer extends from the top surface of the substrate pad to fill a space between a lateral surface of the metal layer and the inner lateral surface of the recess.

    Semiconductor package
    8.
    发明授权

    公开(公告)号:US10741510B2

    公开(公告)日:2020-08-11

    申请号:US16105227

    申请日:2018-08-20

    Abstract: A semiconductor package includes a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, an encapsulant encapsulating at least a portion of the semiconductor chip, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer and a via electrically connected to the connection pads of the semiconductor chip, wherein at least a portion of the redistribution layer and the via is formed of a metal layer having a concave portion depressed from a lower surface thereof and filled with an insulating material.

    Display apparatus
    9.
    发明授权

    公开(公告)号:US10558098B2

    公开(公告)日:2020-02-11

    申请号:US16170862

    申请日:2018-10-25

    Abstract: Provided is a display apparatus including a liquid crystal panel and a shutter panel, wherein the shutter panel includes a shutter layer configured to change a polarizing axis of light transmitted through a selected area, a shutter polarizing layer disposed on a front surface of the shutter layer, and configured to transmit light having the polarizing axis changed by the shutter layer, and a quantum rod layer disposed on a rear surface of the shutter layer, and configured to convert a wavelength of light that is incident to the shutter panel, and to transmit light having a polarizing axis of a predetermined direction to the shutter layer. Therefore, the display apparatus may implement a local dimming structure and improve the optical efficiency.

    Display apparatus
    10.
    发明授权

    公开(公告)号:US10393939B2

    公开(公告)日:2019-08-27

    申请号:US15711618

    申请日:2017-09-21

    Abstract: A display apparatus includes: a display panel; a light source package configured to supply light; and a light guide plate configured to receive the light supplied by the light source package and guide the light to the display panel. The light source package includes: a light source configured to generate the light; a first reflector disposed around the light source; a light converter disposed between the light source and the light guide plate, the light converter being configured to convert properties of the light directed toward the light guide plate; and a second reflector protruding from the light converter toward the light source, the second reflector being configured to reflect the light generated by the light source toward the first reflector, and to reflect light reflected by the light converter toward the light guide plate.

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