公开(公告)号：US20210202292A1

公开(公告)日：2021-07-01

申请号：US16990370

申请日：2020-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heeseok Nho ,  Sangil Choi ,  Seonggi Jeon ,  Bongsu Cho

IPC: H01L21/683 ,  B25J15/06

Abstract: A substrate transfer apparatus includes: a body including a first surface to which a semiconductor substrate is suctioned and a second surface opposing the first surface, the first surface including a cavity disposed in a center region of the body and an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to suction the semiconductor substrate, and a connector connected to the second surface of the body and supporting the body, wherein the cavity includes a lower surface with at least one through hole penetrating the first and second surfaces of the body and connecting the cavity to an external space, and the cavity includes a side surface inclined at an angle of 2.9° to 5° with respect to the first surface at the edge of the body.

公开(公告)号：US20250135601A1

公开(公告)日：2025-05-01

申请号：US18921743

申请日：2024-10-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heeseok Nho ,  Yeoiwon Seo ,  Seonggi Jeon

IPC: B24B49/02

Abstract: A wafer grinding method includes loading a wafer onto a first chuck, first lowering a spindle having a wheel from a first vertical position to a second vertical position, second lowering the spindle from the second vertical position to a third vertical position, grinding the wafer by the wheel, identifying the third vertical position of the spindle by determining whether amounts of change in an operation current of the spindle exceed a reference amount of change in current, calculating spindle feedback displacement, and applying the spindle feedback displacement to the second vertical position of the first chuck.

公开(公告)号：US20250146553A1

公开(公告)日：2025-05-08

申请号：US18651268

申请日：2024-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeil Jeong ,  Yeoiwon Seo ,  Seonggi Jeon

IPC: F16F15/02 ,  B24B41/00

Abstract: A damping apparatus may include a plurality of weights, a plurality of dampers, a plurality of springs and a plurality of pressurizing modules. The plurality of the weights may be connected to a spindle. The plurality of the dampers may be arranged between adjacent lower weights among the plurality of the weights to attenuate a vibration of the spindle. The plurality of the springs may be arranged between adjacent upper weights among the plurality of the weights. The plurality of the pressurizing modules may be configured to selectively connect each of the springs with adjacent upper weights. Thus, a natural frequency of the damping apparatus may be controlled to effectively attenuate the vibration of the spindle.

公开(公告)号：US11450549B2

公开(公告)日：2022-09-20

申请号：US16990370

申请日：2020-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heeseok Nho ,  Sangil Choi ,  Seonggi Jeon ,  Bongsu Cho

IPC: H01L21/683 ,  B25J15/06

Abstract: A substrate transfer apparatus includes: a body including a first surface to which a semiconductor substrate is suctioned and a second surface opposing the first surface, the first surface including a cavity disposed in a center region of the body and an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to suction the semiconductor substrate, and a connector connected to the second surface of the body and supporting the body, wherein the cavity includes a lower surface with at least one through hole penetrating the first and second surfaces of the body and connecting the cavity to an external space, and the cavity includes a side surface inclined at an angle of 2.9° to 5° with respect to the first surface at the edge of the body.