SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER SYSTEM USING THE SAME

    公开(公告)号:US20210202292A1

    公开(公告)日:2021-07-01

    申请号:US16990370

    申请日:2020-08-11

    Abstract: A substrate transfer apparatus includes: a body including a first surface to which a semiconductor substrate is suctioned and a second surface opposing the first surface, the first surface including a cavity disposed in a center region of the body and an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to suction the semiconductor substrate, and a connector connected to the second surface of the body and supporting the body, wherein the cavity includes a lower surface with at least one through hole penetrating the first and second surfaces of the body and connecting the cavity to an external space, and the cavity includes a side surface inclined at an angle of 2.9° to 5° with respect to the first surface at the edge of the body.

    Method and apparatus for displaying screen in device having touch screen

    公开(公告)号:US10261675B2

    公开(公告)日:2019-04-16

    申请号:US14775091

    申请日:2014-03-20

    Abstract: The present invention relates to a method and an apparatus for displaying a screen in a device having a touch screen. The method for displaying a screen in a device having a touch screen, according to the present invention, comprises: a detection step of detecting the approach of a touch means on the touch screen; and a displaying step of magnifying at least one input item corresponding to a position at which the approach has been detected, among a plurality of input items displayed on the touch screen, and displaying the magnified input item. According to the present invention, input errors can be reduced.

    Substrate transfer apparatus and substrate transfer system using the same

    公开(公告)号:US11450549B2

    公开(公告)日:2022-09-20

    申请号:US16990370

    申请日:2020-08-11

    Abstract: A substrate transfer apparatus includes: a body including a first surface to which a semiconductor substrate is suctioned and a second surface opposing the first surface, the first surface including a cavity disposed in a center region of the body and an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to suction the semiconductor substrate, and a connector connected to the second surface of the body and supporting the body, wherein the cavity includes a lower surface with at least one through hole penetrating the first and second surfaces of the body and connecting the cavity to an external space, and the cavity includes a side surface inclined at an angle of 2.9° to 5° with respect to the first surface at the edge of the body.

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