公开(公告)号：US11813716B2

公开(公告)日：2023-11-14

申请号：US17709941

申请日：2022-03-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jwahyeon Kim ,  Sungjoon Joo ,  Bongsu Cho ,  Kyungho Ha

IPC: B24B55/06 ,  B24B37/34

CPC classification number: B24B55/06 ,  B24B37/34

Abstract: A substrate processing apparatus includes a first polishing chamber, a second polishing chamber, a dry polishing chamber and a loading chamber on a turntable. The dry polishing chamber includes a polishing device on the turntable, and a chamber cover including a cover plate, an interception filter at an intake port at the cover plate, and a particle barrier connected to the cover plate. The particle barrier faces the interception filter, and is between the polishing device and the interception filter.

公开(公告)号：US11450549B2

公开(公告)日：2022-09-20

申请号：US16990370

申请日：2020-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heeseok Nho ,  Sangil Choi ,  Seonggi Jeon ,  Bongsu Cho

IPC: H01L21/683 ,  B25J15/06

Abstract: A substrate transfer apparatus includes: a body including a first surface to which a semiconductor substrate is suctioned and a second surface opposing the first surface, the first surface including a cavity disposed in a center region of the body and an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to suction the semiconductor substrate, and a connector connected to the second surface of the body and supporting the body, wherein the cavity includes a lower surface with at least one through hole penetrating the first and second surfaces of the body and connecting the cavity to an external space, and the cavity includes a side surface inclined at an angle of 2.9° to 5° with respect to the first surface at the edge of the body.

公开(公告)号：US20210202292A1

公开(公告)日：2021-07-01

申请号：US16990370

申请日：2020-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heeseok Nho ,  Sangil Choi ,  Seonggi Jeon ,  Bongsu Cho

IPC: H01L21/683 ,  B25J15/06

Abstract: A substrate transfer apparatus includes: a body including a first surface to which a semiconductor substrate is suctioned and a second surface opposing the first surface, the first surface including a cavity disposed in a center region of the body and an attaching unit disposed on an edge of the body so as to surround the cavity and form negative pressure to suction the semiconductor substrate, and a connector connected to the second surface of the body and supporting the body, wherein the cavity includes a lower surface with at least one through hole penetrating the first and second surfaces of the body and connecting the cavity to an external space, and the cavity includes a side surface inclined at an angle of 2.9° to 5° with respect to the first surface at the edge of the body.