公开(公告)号：US20250149357A1

公开(公告)日：2025-05-08

申请号：US18640980

申请日：2024-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyuntae Kim ,  Kyungyeol Kim ,  Jwahyeon Kim ,  Taesung Kim ,  Byunghyuck Ahn

IPC: H01L21/67 ,  B24B41/00 ,  H01L21/677 ,  H01L21/687

Abstract: An example apparatus for processing a wafer includes a grinder, a mounter, and a dock. The grinder is configured to grind a backside of the wafer. The mounter is configured to attach a ring to the wafer. The mounter is configured to remove a protection film from the wafer. The dock configured to dock the mounter with the grinder.

公开(公告)号：US11813716B2

公开(公告)日：2023-11-14

申请号：US17709941

申请日：2022-03-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jwahyeon Kim ,  Sungjoon Joo ,  Bongsu Cho ,  Kyungho Ha

IPC: B24B55/06 ,  B24B37/34

CPC classification number: B24B55/06 ,  B24B37/34

Abstract: A substrate processing apparatus includes a first polishing chamber, a second polishing chamber, a dry polishing chamber and a loading chamber on a turntable. The dry polishing chamber includes a polishing device on the turntable, and a chamber cover including a cover plate, an interception filter at an intake port at the cover plate, and a particle barrier connected to the cover plate. The particle barrier faces the interception filter, and is between the polishing device and the interception filter.