公开(公告)号：US20250149357A1

公开(公告)日：2025-05-08

申请号：US18640980

申请日：2024-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyuntae Kim ,  Kyungyeol Kim ,  Jwahyeon Kim ,  Taesung Kim ,  Byunghyuck Ahn

IPC: H01L21/67 ,  B24B41/00 ,  H01L21/677 ,  H01L21/687

Abstract: An example apparatus for processing a wafer includes a grinder, a mounter, and a dock. The grinder is configured to grind a backside of the wafer. The mounter is configured to attach a ring to the wafer. The mounter is configured to remove a protection film from the wafer. The dock configured to dock the mounter with the grinder.