公开(公告)号：US20250135601A1

公开(公告)日：2025-05-01

申请号：US18921743

申请日：2024-10-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heeseok Nho ,  Yeoiwon Seo ,  Seonggi Jeon

IPC: B24B49/02

Abstract: A wafer grinding method includes loading a wafer onto a first chuck, first lowering a spindle having a wheel from a first vertical position to a second vertical position, second lowering the spindle from the second vertical position to a third vertical position, grinding the wafer by the wheel, identifying the third vertical position of the spindle by determining whether amounts of change in an operation current of the spindle exceed a reference amount of change in current, calculating spindle feedback displacement, and applying the spindle feedback displacement to the second vertical position of the first chuck.

公开(公告)号：US20250146553A1

公开(公告)日：2025-05-08

申请号：US18651268

申请日：2024-04-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeil Jeong ,  Yeoiwon Seo ,  Seonggi Jeon

IPC: F16F15/02 ,  B24B41/00

Abstract: A damping apparatus may include a plurality of weights, a plurality of dampers, a plurality of springs and a plurality of pressurizing modules. The plurality of the weights may be connected to a spindle. The plurality of the dampers may be arranged between adjacent lower weights among the plurality of the weights to attenuate a vibration of the spindle. The plurality of the springs may be arranged between adjacent upper weights among the plurality of the weights. The plurality of the pressurizing modules may be configured to selectively connect each of the springs with adjacent upper weights. Thus, a natural frequency of the damping apparatus may be controlled to effectively attenuate the vibration of the spindle.