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公开(公告)号:US20210151439A1
公开(公告)日:2021-05-20
申请号:US16908833
申请日:2020-06-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: YOONYOUNG CHOI , Byunghyun Lee , Seungjin Kim , Byeongjoo Ku , Sangjae Park , Hangeol Lee
IPC: H01L27/108 , H01L23/532 , H01L21/768
Abstract: A semiconductor device includes a substrate, a storage node electrode disposed on the substrate, a dielectric layer at least partially covering the storage node electrode, and a plate electrode dispose on the dielectric layer. The storage node electrode has a pillar shape, and includes a seam disposed therein. The storage node electrode includes a concave side surface disposed at a higher level than the seam.
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公开(公告)号:US20240315006A1
公开(公告)日:2024-09-19
申请号:US18424447
申请日:2024-01-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kiseok Lee , Huijung Kim , Sangjae Park , Taejin Park , Junhyeok Ahn , Chansic Yoon , Myeongdong Lee
IPC: H10B12/00
CPC classification number: H10B12/315 , H10B12/0335 , H10B12/482
Abstract: A semiconductor device includes an active pattern array including active patterns on a substrate, a first contact structure on a central portion of each active pattern, a bit line structure on the first contact structure, a second contact structure on an end portion of each active pattern, a third contact structure on the second contact structure, a filling pattern between the bit line structure and the third contact structure and including a void, and a capacitor electrically connected to the third contact structure. The active pattern array includes active pattern rows spaced apart from each other in a first direction, and each active pattern row includes the active patterns spaced apart from each other in a second direction. Each active pattern extends in a third direction, and the active patterns in each active pattern row are aligned in the second direction.
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公开(公告)号:US11152368B2
公开(公告)日:2021-10-19
申请号:US16908833
申请日:2020-06-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yoonyoung Choi , Byunghyun Lee , Seungjin Kim , Byeongjoo Ku , Sangjae Park , Hangeol Lee
IPC: H01L27/108 , H01L21/768 , H01L23/532
Abstract: A semiconductor device includes a substrate, a storage node electrode disposed on the substrate, a dielectric layer at least partially covering the storage node electrode, and a plate electrode dispose on the dielectric layer. The storage node electrode has a pillar shape, and includes a seam disposed therein. The storage node electrode includes a concave side surface disposed at a higher level than the seam.
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公开(公告)号:US20240306374A1
公开(公告)日:2024-09-12
申请号:US18414655
申请日:2024-01-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: KEUNNAM KIM , Seungbo Ko , Jongmin Kim , Huijung Kim , Sangjae Park , Taejin Park , Chansic Yoon , Kiseok Lee , Myeongdong Lee
IPC: H10B12/00
CPC classification number: H10B12/482 , H10B12/0335 , H10B12/315
Abstract: A semiconductor device includes an active pattern array including active patterns, an isolation pattern, gate structures, bit line structures, and lower and upper contact plugs. The isolation pattern covers sidewalls of the active patterns. The gate structures extend through upper portions of the active patterns and the isolation pattern in a first direction, and are spaced apart from each other in a second direction. The bit line structures are on central portions of the active patterns and the isolation pattern, extend in the second direction, and are spaced apart from each other in the first direction. The lower contact plugs are disposed on end portions of the active patterns. The upper contact plugs are disposed on the lower contact plugs. The active pattern array includes active pattern rows including the active patterns spaced apart from each other in the first direction.
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公开(公告)号:US11462610B2
公开(公告)日:2022-10-04
申请号:US16947090
申请日:2020-07-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yoonyoung Choi , Byunghyun Lee , Byeongjoo Ku , Seungjin Kim , Sangjae Park , Jinwoo Bae , Hangeol Lee , Bowo Choi , Hyunsil Hong
IPC: H01L27/108 , H01L49/02
Abstract: Capacitor forming methods may include sequentially forming a first mold layer, a first support material layer, and a second mold layer on a substrate, forming a mask pattern on the second mold layer, forming a recess in the second mold layer, the first support material layer, and the first mold layer using the mask pattern as a mask, forming a lower electrode in the recess, removing the mask pattern by a dry cleaning process, reducing a width of an upper portion of the lower electrode, removing the first mold layer, forming a dielectric layer on a surface of the lower electrode, and forming an upper electrode on the dielectric layer.
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