公开(公告)号：US20230062677A1

公开(公告)日：2023-03-02

申请号：US17735593

申请日：2022-05-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Chul YEO ,  Min-Cheol KANG ,  Sooryong LEE

IPC: H01L21/66 ,  G01N21/88

Abstract: Disclosed are a method of forming an optical proximity correction (OPC) model and/or a method of fabricating a semiconductor device using the same. The method of forming the OPC model may include obtaining a scanning electron microscope (SEM) image, which is an average image of a plurality of images taken using one or more scanning electron microscopes, and a graphic data system (GDS) image, which is obtained by imaging a designed layout, aligning the SEM image and the GDS image, performing an image filtering process on the SEM image, extracting a contour from the SEM image, and verifying the contour. The verifying of the contour may be performed using a genetic algorithm. Variables in the genetic algorithm may include first parameters related to the image alignment process, second parameters related to the image filtering process, and third parameters related to a critical dimension (CD) measurement process.

公开(公告)号：US20230214990A1

公开(公告)日：2023-07-06

申请号：US17900334

申请日：2022-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-Cheol KANG ,  SOORYONG LEE ,  KYEN-HEE LEE

IPC: G06T7/00 ,  G06T7/30 ,  G06T11/00

CPC classification number: G06T7/001 ,  G06T7/30 ,  G06T11/00 ,  G06T2207/30148 ,  G06T2207/20084 ,  G06T2207/10061

Abstract: Disclosed is a semiconductor integrated circuit fabricating method of a semiconductor fabricating device which includes a processor executing a defect detection module includes receiving, at the defect detection module, a first capture image of the semiconductor integrated circuit and a first layout image, generating, at the defect detection module, a second layout image from the first capture image, generating, at the defect detection module, a contour image from the first capture image and the second layout image, detecting, at the defect detection module, a defect of the semiconductor integrated circuit based on the first layout image and the contour image, analyzing, at the semiconductor fabricating device, a correlation between a kind of the defect and process variations of the semiconductor integrated circuit, and changing, at the semiconductor fabricating device, at least one process variation having a correlation with the defect from among the process variations.

公开(公告)号：US20220207699A1

公开(公告)日：2022-06-30

申请号：US17547503

申请日：2021-12-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min-Cheol KANG ,  Dong Hoon KUK

IPC: G06T7/00 ,  G06T5/00 ,  G06T7/13 ,  G06T7/30

Abstract: A method of manufacturing a semiconductor device that includes providing a substrate having a pattern formed thereon. A scanning electron microscope (SEM) image is generated that includes a boundary image showing an edge of the pattern. A blended image is generated by performing at least one blending operation on the SEM image and a background image aligned with the boundary image. Contour data is generated by binarizing the blended image on a basis of a threshold value. The threshold value is determined by a critical dimension of the pattern.

公开(公告)号：US20220035237A1

公开(公告)日：2022-02-03

申请号：US17245947

申请日：2021-04-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soo Yong LEE ,  Min-Cheol KANG ,  U Seong KIM ,  Seung Hune YANG ,  Jee Yong LEE

IPC: G03F1/36 ,  G03F1/76 ,  G06T7/00 ,  G06T3/40

Abstract: A process proximity correction method is performed by a process proximity correction computing device which performs a process proximity correction (PPC) through at least one of a plurality of processors. The process proximity correction method includes: converting a target layout including a plurality of patterns into an image, zooming-in or zooming-out the image at a plurality of magnifications to generate a plurality of input channels, receiving the plurality of input channels and performing machine learning to predict an after-cleaning image (ACI), comparing the predicted after-cleaning image with a target value to generate an after-cleaning image error, and adjusting the target layout on the basis of the after-cleaning image error.

公开(公告)号：US20240386635A1

公开(公告)日：2024-11-21

申请号：US18528275

申请日：2023-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Chul YEO ,  Yongjin CHUN ,  Min-Cheol KANG ,  Jaewon YANG

IPC: G06T11/60 ,  G06T7/13 ,  G06V10/24 ,  G06V10/50 ,  G06V10/74

Abstract: Disclosed is an operating method of an electronic device which includes a processor and supports manufacture of a semiconductor device. The operating method includes receiving, at the processor, a layout image for the manufacture of the semiconductor device and a captured image generated by capturing the semiconductor device actually manufactured, aligning, at the processor, the layout image and the captured image based on a result of emphasizing edges and corners of the layout image and the captured image, and performing, at the processor, learning based on the aligned layout image and the aligned captured image such that a first modified layout image is generated from the layout image, and the semiconductor device is manufactured based on a second modified layout image generated from the layout image.

公开(公告)号：US20180027107A1

公开(公告)日：2018-01-25

申请号：US15724799

申请日：2017-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Woo PARK ,  Seung-Yeol LEE ,  Byung-Il HAN ,  Min-Cheol KANG ,  Chan-Hee YOON

IPC: H04M1/725 ,  G06F17/30 ,  H04N1/21 ,  H04N1/00

CPC classification number: H04M1/72522 ,  G06F16/164 ,  H04M1/72555 ,  H04M2250/52 ,  H04N1/00307 ,  H04N1/2104 ,  H04N2201/0087 ,  H04N2201/3229 ,  H04N2201/328

Abstract: An apparatus and method for storing an image in a storage folder corresponding to a file name in a mobile device are provided. The method includes obtaining a keyword list by analyzing a file name of the data to be stored, searching for at least one storage folder having a folder name corresponding to at least one keyword included in the keyword list, determining one of the found storage folders, and storing the data in the determined storage folder.

公开(公告)号：US20230069493A1

公开(公告)日：2023-03-02

申请号：US17856130

申请日：2022-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Do-Nyun KIM ,  Min-Cheol KANG ,  Kihyun KIM ,  Jaehoon KIM ,  Jaekyung LIM

IPC: G06T7/00 ,  G01N21/95 ,  H01L21/66

Abstract: Disclosed is an operating method of an electronic device for manufacture of a semiconductor device. The method includes receiving, at the electronic device, a computer-aided design (CAD) image for a lithography process of the semiconductor device, and generating, at the electronic device, a first scanning electron microscope (SEM) image and a first segment (SEG) image from the CAD image by using a machine learning-based module, and the first SEG image includes information about a location of a defect.

公开(公告)号：US20220108436A1

公开(公告)日：2022-04-07

申请号：US17465179

申请日：2021-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-Cheol KANG ,  Do-Nyun KIM ,  Jaehoon KIM ,  Woojoo SIM

IPC: G06T7/00

Abstract: Disclosed is a wafer defect inference system, which includes a test equipment that receives a first image obtained by imaging circuit patterns formed on a semiconductor wafer by using a scanning electron microscope and a second image obtained by imaging a layout image of a mask for implementing the circuit pattern on the semiconductor wafer and combines the first image and the second image to generate a combination image, and at least one computing device that is capable of communicating with the test equipment and infers a defect associated with the circuit pattern formed on the semiconductor wafer. The computing device receives the combination image, performs machine learning for inferring the defect based on the combination image, and generates an output image including information about the defect based on the machine learning.