公开(公告)号：US20160103221A1

公开(公告)日：2016-04-14

申请号：US14742033

申请日：2015-06-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YoungTaek OH ,  Won-Chul BANG ,  Jiwon RYU ,  Jayeon JEONG ,  MINWOO LEE

IPC: G01S15/89 ,  G01N29/24

CPC classification number: G01N29/24 ,  G01S7/52073 ,  G01S7/52074 ,  G01S7/5208 ,  G01S15/8936 ,  G01S15/8993 ,  G01S15/8995

Abstract: Provided is an ultrasonic imaging apparatus including an ultrasonic probe configured to receive a first ultrasonic signal and a second ultrasonic signal corresponding an object; and an image processor configured to obtain second ultrasonic volume data based on the second ultrasonic signal and relationship information between first information and second information, configured to apply the relationship information to the second ultrasonic volume data and configured to obtain a second ultrasonic cross-sectional image from the second ultrasonic volume data based on the relationship information, where the first information comprises a first position and a first direction corresponding to a position and a direction of the ultrasonic probe receiving the first ultrasonic signal and the second information comprises a second position and a second direction corresponding to a position and a direction of the ultrasonic probe receiving the second ultrasonic signal.

Abstract translation: 提供一种超声波成像装置，包括：超声波探头，被配置为接收对应于物体的第一超声波信号和第二超声波信号; 以及图像处理器，被配置为基于所述第二超声波信号获得第二超声波体积数据，以及第一信息和第二信息之间的关系信息，被配置为将所述关系信息应用于所述第二超声波体积数据，并且被配置为获得第二超声波截面图像 基于所述关系信息从所述第二超声波容积数据中选择所述第一信息，其中所述第一信息包括与所述超声波探头接收所述第一超声波信号的位置和方向相对应的第一位置和第一方向，所述第二信息包括第二位置和 第二方向对应于接收第二超声波信号的超声波探头的位置和方向。

公开(公告)号：US20250120099A1

公开(公告)日：2025-04-10

申请号：US18736967

申请日：2024-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： MINWOO LEE ,  BYOUNGKON JO ,  DUK SUNG KIM ,  JOONHO JUN ,  DOOHEE HWANG

IPC: H10B80/00 ,  H01L25/065 ,  H01L25/18

Abstract: A memory device includes: first and second core dies that include a plurality of memory cells and are stacked in a first direction, and a buffer die that is stacked with the first and second core dies in the first direction and includes a first physical layer and a second physical layer, wherein the buffer die is configured to output data of the plurality of memory cells through the first physical layer, wherein the data of the plurality of memory cells is provided from the first and second core dies through through-vias that pass through the first and second core dies in the first direction, and wherein the second physical layer is separated from the first physical layer and is configured to receive power signals from outside.

公开(公告)号：US20240422450A1

公开(公告)日：2024-12-19

申请号：US18400213

申请日：2023-12-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： MINWOO LEE ,  MIN-SUN KEEL ,  KYUNG-MIN KIM

IPC: H04N25/75 ,  H04N25/76 ,  H04N25/772

Abstract: Disclosed is an image sensor device which includes a first pixel located at a first row and a first column, corresponding to a first color filter, and outputting a first pixel signal through a first column line, a second pixel located at a second row different from the first row and the first column, corresponding to the first color filter, and outputting a second pixel signal through a second column line, and a conversion circuit receiving the first pixel signal through the first column line, receiving the second pixel signal through the second column line, and generating first image data and second image data based on the first pixel signal and the second pixel signal. The first pixel signal and the second pixel signal are respectively output through the first column line and the second column line simultaneously.