公开(公告)号：US20250120099A1

公开(公告)日：2025-04-10

申请号：US18736967

申请日：2024-06-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： MINWOO LEE ,  BYOUNGKON JO ,  DUK SUNG KIM ,  JOONHO JUN ,  DOOHEE HWANG

IPC: H10B80/00 ,  H01L25/065 ,  H01L25/18

Abstract: A memory device includes: first and second core dies that include a plurality of memory cells and are stacked in a first direction, and a buffer die that is stacked with the first and second core dies in the first direction and includes a first physical layer and a second physical layer, wherein the buffer die is configured to output data of the plurality of memory cells through the first physical layer, wherein the data of the plurality of memory cells is provided from the first and second core dies through through-vias that pass through the first and second core dies in the first direction, and wherein the second physical layer is separated from the first physical layer and is configured to receive power signals from outside.

公开(公告)号：US20250013366A1

公开(公告)日：2025-01-09

申请号：US18597373

申请日：2024-03-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： BYOUNGKON JO ,  Minwoo LEE ,  Joonho JUN ,  Duk Sung KIM ,  Doohee HWANG

IPC: G06F3/06

Abstract: There is provided a memory device including a content addressable memory physical layer connected to external data pads. During the write operation, the content addressable memory physical layer transmits a selected data pattern from among data patterns stored in a content addressable memory cell array as input data to selected memory cells of a memory cell array corresponding to an address received from external device based on first data received from the external data pads. During the read operation, the content addressable memory physical layer compares output data read from the memory cell array with the data patterns based on an address received from external device, and outputs content addressable memory address corresponding to data pattern matched by a result of the comparing as second data through the external data pads.