THREE-DIMENSIONAL CAMERA SYSTEM
    1.
    发明申请

    公开(公告)号:US20230005170A1

    公开(公告)日:2023-01-05

    申请号:US17943068

    申请日:2022-09-12

    IPC分类号: G06T7/521

    摘要: A camera system. In some embodiments, the camera system includes a first laser, a camera, and a processing circuit connected to the first laser and to the camera. The first laser may be steerable, and the camera may include a pixel including a photodetector and a pixel circuit, the pixel circuit including a first time-measuring circuit.

    Time-resolving sensor for range measurement and 2D greyscale imaging

    公开(公告)号:US11348954B2

    公开(公告)日:2022-05-31

    申请号:US16409767

    申请日:2019-05-10

    摘要: A pixel of an image sensor includes a pinned photodiode (PPD), a switching device and an output circuit. A first terminal of the switching device is coupled to the PPD. A second terminal of the switching device is coupled to a floating diffusion (FD). A third terminal of the switching device is coupled to a first enable signal and a second enable signal. The switching device is responsive to the first enable signal to transfer a first charge on the PPD to the FD, and responsive to the second enable signal to transfer a second charge on the PPD to the FD. The output circuit outputs a first voltage based on the first charge and outputs a second voltage based on the second charge in which the first voltage corresponds to a time of flight of one or more detected photons and the second voltage corresponds to a greyscale image.

    LWIR sensor with capacitive microbolometer and hybrid visible/LWIR sensor

    公开(公告)号:US11496697B2

    公开(公告)日:2022-11-08

    申请号:US16868527

    申请日:2020-05-06

    IPC分类号: H04N5/33 H04L27/14 H01L27/146

    摘要: A pixel for an image sensor includes a microbolometer sensor portion, a visible image sensor portion and an output path. The microbolometer sensor portion outputs a signal corresponding to an infrared (IR) image sensed by the microbolometer sensor portion. The visible image sensor portion outputs a signal corresponding to a visible image sensed by the visible image sensor portion. The output path is shared by the microbolometer and the visible image sensor portions, and is controlled to selectively output the signal corresponding to the IR image or the signal corresponding to the visible image. The output path may be further shared with a visible image sensor portion of an additional pixel, in which case the output path may be controlled to selectively to also output the signal corresponding to a visible image of the additional pixel.

    Multi-camera on a chip and camera module design

    公开(公告)号:US11201993B1

    公开(公告)日:2021-12-14

    申请号:US16945787

    申请日:2020-07-31

    IPC分类号: H04N5/225 H04N5/232

    摘要: A camera system includes two or more sensor arrays and an optical path. The sensor arrays are on the same sensor chip. Each sensor array includes the same field of view (FOV) as each other sensor array. The optical path includes a main lens and a metalens that are shared by each sensor array, and a microlens associated with each sensor array. The metalens splits incident light into different spectrums of light and directs each respective spectrum to a corresponding sensor array. The different spectrums of light include at least two of visible light, near infrared light, shortwave infrared and longwave infrared, and at least one sensor array includes single-photon avalanche diodes. The image processor that provides image processing, object recognition and object tracking and/or image fusion functionality may be on the same sensor chip as the sensor arrays.

    THREE-DIMENSIONAL CAMERA SYSTEM
    5.
    发明申请

    公开(公告)号:US20210327078A1

    公开(公告)日:2021-10-21

    申请号:US16894705

    申请日:2020-06-05

    IPC分类号: G06T7/521

    摘要: A camera system. In some embodiments, the camera system includes a first laser, a camera, and a processing circuit connected to the first laser and to the camera. The first laser may be steerable, and the camera may include a pixel including a photodetector and a pixel circuit, the pixel circuit including a first time-measuring circuit.

    CMOS image sensor for RGB imaging and depth measurement with laser sheet scan

    公开(公告)号:US10830577B2

    公开(公告)日:2020-11-10

    申请号:US16595461

    申请日:2019-10-07

    摘要: An imaging unit includes a light source and a pixel array. The light source projects a line of light that is scanned in a first direction across a field of view of the light source. The line of light oriented in a second direction that is substantially perpendicular to the first direction. The pixel array is arranged in at least one row of pixels that extends in a direction that is substantially parallel to the second direction. At least one pixel in a row is capable of generating two-dimensional color information of an object in the field of view based on a first light reflected from the object and is capable of generating three-dimensional (3D) depth information of the object based on the line of light reflecting from the object. The 3D-depth information includes time-of-flight information.

    Multi-camera on a chip and camera module design

    公开(公告)号:US11696003B2

    公开(公告)日:2023-07-04

    申请号:US17527155

    申请日:2021-11-15

    IPC分类号: H04N23/45 H04N23/55 H04N23/80

    CPC分类号: H04N23/45 H04N23/55 H04N23/80

    摘要: A camera system includes two or more sensor arrays and an optical path. The sensor arrays are on the same sensor chip. Each sensor array includes the same field of view (FOV) as each other sensor array. The optical path includes a main lens and a metalens that are shared by each sensor array, and a microlens associated with each sensor array. The metalens splits incident light into different spectrums of light and directs each respective spectrum to a corresponding sensor array. The different spectrums of light include at least two of visible light, near infrared light, shortwave infrared and longwave infrared, and at least one sensor array includes single-photon avalanche diodes. The image processor that provides image processing, object recognition and object tracking and/or image fusion functionality may be on the same sensor chip as the sensor arrays.

    CMOS image sensor for RGB imaging and depth measurement with laser sheet scan

    公开(公告)号:US11131542B2

    公开(公告)日:2021-09-28

    申请号:US16988593

    申请日:2020-08-07

    摘要: An imaging unit includes a light source and a pixel array. The light source projects a line of light that is scanned in a first direction across a field of view of the light source. The line of light oriented in a second direction that is substantially perpendicular to the first direction. The pixel array is arranged in at least one row of pixels that extends in a direction that is substantially parallel to the second direction. At least one pixel in a row is capable of generating two-dimensional color information of an object in the field of view based on a first light reflected from the object and is capable of generating three-dimensional (3D) depth information of the object based on the line of light reflecting from the object. The 3D-depth information includes time-of-flight information.

    Readout architecture for FMCW LiDAR

    公开(公告)号:US11988779B2

    公开(公告)日:2024-05-21

    申请号:US17011813

    申请日:2020-09-03

    摘要: Provided is a readout integrated circuit of a FMCW LiDAR system includes a transimpedance amplifier to receive an optical signal of optical mixer output from balanced PIN photo diode, convert the received optical signal into a current signal including a mixed signal of high and low frequencies, and convert the current signal into a voltage signal including a low frequency sinusoidal waveform, a comparator to receive the voltage signal, and generate a pulse signal from the voltage signal, a primary counter to receive a primary signal corresponding to the pulse signal, and count a number of pulses to generate primary counter data, a reference counter to receive a reference signal, and count a number of pulses to generate reference counter data, and an arithmetic logic unit to receive the primary and reference counter data, and calculate depth information corresponding to a distance of a target.