公开(公告)号：US20200091186A1

公开(公告)日：2020-03-19

申请号：US16379063

申请日：2019-04-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun YANG ,  Bio Kim ,  Yujin Kim ,  Kyong-Won An ,  Sookyeom Yong ,  Junggeun Jee ,  Youngjun Cheon

IPC: H01L27/11582 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/1157

Abstract: A three-dimensional semiconductor memory device is provided. The device may include a first stack structure on a substrate including a cell array region and a connection region, a second stack structure on the first stack structure, a first vertical channel hole penetrating the first stack structure and partially exposing the substrate and a bottom surface of the second stack structure, on the cell array region, a second vertical channel hole penetrating the second stack structure and exposing the first vertical channel hole, on the cell array region, a bottom diameter of the second vertical channel hole being smaller than an top diameter of the first vertical channel hole, and a buffer pattern placed in the first vertical channel hole and adjacent to the bottom surface of the second stack structure.

公开(公告)号：US11532639B2

公开(公告)日：2022-12-20

申请号：US17036594

申请日：2020-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangsoo Lee ,  Chaeho Kim ,  Woosung Lee ,  Phil Ouk Nam ,  Junggeun Jee

IPC: H01L27/11582 ,  H01L27/11519 ,  H01L27/11556 ,  H01L23/535 ,  H01L27/11565 ,  H01L27/11573 ,  H01L27/11529

Abstract: Disclosed is a three-dimensional semiconductor memory device including a carbon-containing layer on a substrate, a plurality of electrode interlayer dielectric layers and a plurality of electrode layers that are alternately stacked on the carbon-containing layer, a cell vertical pattern that penetrates at least some of the electrode interlayer dielectric layers and the electrode layers, and a semiconductor pattern between the cell vertical pattern and the carbon-containing layer. The substrate includes a plurality of first grains. The semiconductor pattern includes a plurality of second grains. An average size of the second grains is less than an average size of the first grains.

公开(公告)号：US10797074B2

公开(公告)日：2020-10-06

申请号：US16379063

申请日：2019-04-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun Yang ,  Bio Kim ,  Yujin Kim ,  Kyong-Won An ,  Sookyeom Yong ,  Junggeun Jee ,  Youngjun Cheon

IPC: H01L27/11578 ,  H01L27/11582 ,  H01L27/1157 ,  H01L27/11556 ,  H01L27/11524

Abstract: A three-dimensional semiconductor memory device is provided. The device may include a first stack structure on a substrate including a cell array region and a connection region, a second stack structure on the first stack structure, a first vertical channel hole penetrating the first stack structure and partially exposing the substrate and a bottom surface of the second stack structure, on the cell array region, a second vertical channel hole penetrating the second stack structure and exposing the first vertical channel hole, on the cell array region, a bottom diameter of the second vertical channel hole being smaller than an top diameter of the first vertical channel hole, and a buffer pattern placed in the first vertical channel hole and adjacent to the bottom surface of the second stack structure.

公开(公告)号：US20200020713A1

公开(公告)日：2020-01-16

申请号：US16203790

申请日：2018-11-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunyeoung CHOI ,  Hyung Joon Kim ,  Bio Kim ,  Yujin Kim ,  Junggeun Jee

IPC: H01L27/11582 ,  H01L27/1157 ,  H01L23/532

Abstract: A semiconductor device includes a lower stack structure on a substrate, an upper stack structure on the lower stack structure, and a channel structure in a channel hole formed through the upper stack structure and the lower stack structure. The channel hole includes a lower channel hole in the lower stack structure, an upper channel hole in the upper stack structure, and a partial extension portion adjacent to an interface between the lower stack structure and the upper stack structure. The partial extension portion is in fluid communication with the lower channel hole and the upper channel hole. A lateral width of the partial extension portion may be greater than a lateral width of the upper channel hole adjacent to the partial extension portion and greater than a lateral width of the upper channel hole adjacent to the partial extension portion.

公开(公告)号：US11569261B2

公开(公告)日：2023-01-31

申请号：US17005495

申请日：2020-08-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun Yang ,  Bio Kim ,  Yujin Kim ,  Kyong-Won An ,  Sookyeom Yong ,  Junggeun Jee ,  Youngjun Cheon

IPC: H01L27/11582 ,  H01L27/1157 ,  H01L27/11556 ,  H01L27/11524

Abstract: A three-dimensional semiconductor memory device is provided. The device may include a first stack structure on a substrate including a cell array region and a connection region, a second stack structure on the first stack structure, a first vertical channel hole penetrating the first stack structure and partially exposing the substrate and a bottom surface of the second stack structure, on the cell array region, a second vertical channel hole penetrating the second stack structure and exposing the first vertical channel hole, on the cell array region, a bottom diameter of the second vertical channel hole being smaller than an top diameter of the first vertical channel hole, and a buffer pattern placed in the first vertical channel hole and adjacent to the bottom surface of the second stack structure.

公开(公告)号：US10825833B1

公开(公告)日：2020-11-03

申请号：US16930711

申请日：2020-07-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunyeoung Choi ,  Hyung Joon Kim ,  Bio Kim ,  Yujin Kim ,  Junggeun Jee

IPC: H01L27/11582 ,  H01L27/1157 ,  H01L23/532

Abstract: A semiconductor device includes a lower stack structure on a substrate, an upper stack structure on the lower stack structure, and a channel structure in a channel hole formed through the upper stack structure and the lower stack structure. The channel hole includes a lower channel hole in the lower stack structure, an upper channel hole in the upper stack structure, and a partial extension portion adjacent to an interface between the lower stack structure and the upper stack structure. The partial extension portion is in fluid communication with the lower channel hole and the upper channel hole. A lateral width of the partial extension portion may be greater than a lateral width of the upper channel hole adjacent to the partial extension portion and greater than a lateral width of the upper channel hole adjacent to the partial extension portion.

公开(公告)号：US10756107B2

公开(公告)日：2020-08-25

申请号：US16203790

申请日：2018-11-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunyeoung Choi ,  Hyung Joon Kim ,  Bio Kim ,  Yujin Kim ,  Junggeun Jee

IPC: H01L27/11582 ,  H01L23/532 ,  H01L27/1157

Abstract: A semiconductor device includes a lower stack structure on a substrate, an upper stack structure on the lower stack structure, and a channel structure in a channel hole formed through the upper stack structure and the lower stack structure. The channel hole includes a lower channel hole in the lower stack structure, an upper channel hole in the upper stack structure, and a partial extension portion adjacent to an interface between the lower stack structure and the upper stack structure. The partial extension portion is in fluid communication with the lower channel hole and the upper channel hole. A lateral width of the partial extension portion may be greater than a lateral width of the upper channel hole adjacent to the partial extension portion and greater than a lateral width of the upper channel hole adjacent to the partial extension portion.