公开(公告)号：US10312059B2

公开(公告)日：2019-06-04

申请号：US15255626

申请日：2016-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chulkyun Seok ,  Taekyun Kang ,  JungHwan Um ,  Changwon Choi

IPC: H01L21/31 ,  H01J37/32

Abstract: A substrate processing system includes a wall liner, an electrostatic chuck in the wall liner to hold a substrate, and a ring member including a focus ring and a side ring. The focus ring is on an edge region of the electrostatic chuck and the side ring encloses an outer side surface of the focus ring and a side surface of the electrostatic chuck. The side ring includes air holes extending from a bottom surface of the ring member towards a top portion of the ring member and extending from the top portion of the ring member towards an outer side surface of the ring member.

公开(公告)号：US20180090344A1

公开(公告)日：2018-03-29

申请号：US15470044

申请日：2017-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： SungHyup KIM ,  Dong-Wook Kim ,  Sungmoon Park ,  JungHwan Um ,  Taeseok Oh

IPC: H01L21/67 ,  H01L21/673 ,  H01J37/32 ,  H01L21/68 ,  H01L21/3065

Abstract: A ring assembly and a chuck assembly therewith are provided. The ring assembly may include an edge ring that is provided to enclose a chuck body supporting a substrate. The edge ring may include a first top surface, a second top surface positioned outside the first top surface and above the first top surface, a first inner side surface connecting the first top surface to the second top surface, and at least one first flow hole extending outward from one of the first top surface and the first inner side surface, thereby penetrating the edge ring.

公开(公告)号：US10892142B2

公开(公告)日：2021-01-12

申请号：US16182737

申请日：2018-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangjean Jeon ,  Jinyoung Park ,  Chanhoon Park ,  Hoyong Park ,  Jin Young Bang ,  JungHwan Um ,  Il Sup Choi ,  Je-Woo Han

IPC: H01J37/32 ,  H01L21/683

Abstract: A system for fabricating a semiconductor device may include a chamber, an electrostatic chuck used to load a substrate, a power source supplying an RF power to the electrostatic chuck, an impedance matcher between the power source and the electrostatic chuck, and a power transmission unit connecting the electrostatic chuck to the impedance matcher. The power transmission unit may include a power rod, which is connected to the electrostatic chuck and has a first outer diameter, and a coaxial cable. The coaxial cable may include an inner wire, an outer wire, and a dielectric material between the outer and inner wires. The inner wire connects the power rod to the impedance matcher and has a second outer diameter less than the first outer diameter. The outer wire is connected to the chamber and is provided to enclose the inner wire and has a first inner diameter less than the first outer diameter and greater than the second outer diameter. A ratio of the first inner diameter to the second outer diameter is greater than a dielectric constant of the dielectric material and less than three times the dielectric constant of the dielectric material.

公开(公告)号：US10672629B2

公开(公告)日：2020-06-02

申请号：US15470044

申请日：2017-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： SungHyup Kim ,  Dong-Wook Kim ,  Sungmoon Park ,  JungHwan Um ,  Taeseok Oh

IPC: H01L21/67 ,  H01L21/687 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/673 ,  H01L21/68

Abstract: A ring assembly and a chuck assembly therewith are provided. The ring assembly may include an edge ring that is provided to enclose a chuck body supporting a substrate. The edge ring may include a first top surface, a second top surface positioned outside the first top surface and above the first top surface, a first inner side surface connecting the first top surface to the second top surface, and at least one first flow hole extending outward from one of the first top surface and the first inner side surface, thereby penetrating the edge ring.