公开(公告)号：US10411062B2

公开(公告)日：2019-09-10

申请号：US15602185

申请日：2017-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun Hyung Kim ,  Seokho Kim ,  SungHyup Kim ,  Jaegeun Kim ,  Taeyeong Kim

IPC: H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L27/146 ,  H01L21/20

Abstract: Disclosed are a substrate bonding apparatus and a method of manufacturing a semiconductor device. The substrate bonding apparatus comprises vacuum pumps, a first chuck engaged with the vacuum pumps and adsorbing a first substrate at vacuum pressure of the vacuum pumps, and a pushing unit penetrating a center of the first chuck and pushing the first substrate away from the first chuck. The first chuck comprises adsorption sectors providing different vacuum pressures in an azimuth direction to the first substrate.

公开(公告)号：US10672629B2

公开(公告)日：2020-06-02

申请号：US15470044

申请日：2017-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： SungHyup Kim ,  Dong-Wook Kim ,  Sungmoon Park ,  JungHwan Um ,  Taeseok Oh

IPC: H01L21/67 ,  H01L21/687 ,  H01J37/32 ,  H01L21/3065 ,  H01L21/673 ,  H01L21/68

Abstract: A ring assembly and a chuck assembly therewith are provided. The ring assembly may include an edge ring that is provided to enclose a chuck body supporting a substrate. The edge ring may include a first top surface, a second top surface positioned outside the first top surface and above the first top surface, a first inner side surface connecting the first top surface to the second top surface, and at least one first flow hole extending outward from one of the first top surface and the first inner side surface, thereby penetrating the edge ring.