公开(公告)号：US10312059B2

公开(公告)日：2019-06-04

申请号：US15255626

申请日：2016-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chulkyun Seok ,  Taekyun Kang ,  JungHwan Um ,  Changwon Choi

IPC: H01L21/31 ,  H01J37/32

Abstract: A substrate processing system includes a wall liner, an electrostatic chuck in the wall liner to hold a substrate, and a ring member including a focus ring and a side ring. The focus ring is on an edge region of the electrostatic chuck and the side ring encloses an outer side surface of the focus ring and a side surface of the electrostatic chuck. The side ring includes air holes extending from a bottom surface of the ring member towards a top portion of the ring member and extending from the top portion of the ring member towards an outer side surface of the ring member.