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    Fan-out semiconductor package
    1.
    发明授权
    Fan-out semiconductor package 有权

    公开(公告)号：US10522497B2

    公开(公告)日：2019-12-31

    申请号：US15988647

    申请日：2018-05-24

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jeong Ho Lee ,  Bong Ju Cho ,  Young Gwan Ko ,  Jin Su Kim ,  Shang Hoon Seo ,  Jeong Il Lee

    IPC: H01L23/48 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/31 ,  H01L21/683

    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface, and disposed in the recess portion so that the inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers of the frame and the connection pads of the semiconductor chip to each other, wherein the stopper layer includes an insulating material.

    Fan-out semiconductor package
    2.
    发明授权
    Fan-out semiconductor package 有权

    公开(公告)号：US10475748B2

    公开(公告)日：2019-11-12

    申请号：US15981651

    申请日：2018-05-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jeong Ho Lee ,  Myung Sam Kang ,  Young Gwan Ko ,  Shang Hoon Seo ,  Jin Su Kim

    IPC: H01L23/538 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00

    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; a first encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; an electronic component disposed on the other surface of the frame opposing one surface of the frame in which the semiconductor chip is disposed; a second encapsulant covering at least portions of the electronic component; and a connection member disposed on the frame and an active surface of the semiconductor chip and including a redistribution layer, wherein the connection pads and the electronic component are electrically connected to each other through the wiring layers and the redistribution layer.

    Fan-out semiconductor package
    3.
    发明授权
    Fan-out semiconductor package 有权

    公开(公告)号：US10418317B2

    公开(公告)日：2019-09-17

    申请号：US16037670

    申请日：2018-07-17

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sang Kyu Lee ,  Jeong Ho Lee

    IPC: H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L23/00 ,  H01L25/065

    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a first recess portion and a first stopper layer disposed on a bottom surface of the first recess portion; a semiconductor chip disposed in the first recess portion and having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface and disposed on the first stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the first recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers of the frame and the connection pads of the semiconductor chip to each other.

    Fan-out semiconductor package
    4.
    发明授权
    Fan-out semiconductor package 有权

    公开(公告)号：US10410961B2

    公开(公告)日：2019-09-10

    申请号：US15978727

    申请日：2018-05-14

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jeong Ho Lee ,  Myung Sam Kang ,  Young Gwan Ko ,  Jin Su Kim ,  Shang Hoon Seo ,  Jeong Il Lee

    IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion and a stopper layer disposed on a bottom surface of the recess portion; a semiconductor chip disposed in the recess portion, and having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface and disposed on the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the plurality of wiring layers of the frame and the connection pads of the semiconductor chip to each other. The active surface of the semiconductor chip and an upper surface of the encapsulant have a step portion therebetween.

    Fan-out semiconductor package
    5.
    发明授权
    Fan-out semiconductor package 有权

    公开(公告)号：US10985127B2

    公开(公告)日：2021-04-20

    申请号：US16698516

    申请日：2019-11-27

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jeong Ho Lee ,  Bong Ju Cho ,  Young Gwan Ko ,  Jin Su Kim ,  Shang Hoon Seo ,  Jeong Il Lee

    IPC: H01L23/48 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/31 ,  H01L21/683

    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface, and disposed in the recess portion so that the inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers of the frame and the connection pads of the semiconductor chip to each other, wherein the stopper layer includes an insulating material.

    Fan-out semiconductor package
    7.
    发明授权
    Fan-out semiconductor package 有权

    公开(公告)号：US10453788B2

    公开(公告)日：2019-10-22

    申请号：US15988893

    申请日：2018-05-24

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jeong II Lee ,  Jeong Ho Lee ,  Jin Su Kim ,  Bong Ju Cho

    IPC: H01L23/48 ,  H01L23/498 ,  H01L23/00 ,  H01L23/495 ,  H01L23/31

    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers disposed on the insulating layers, and connection via layers penetrating through the insulating layers and electrically connecting the wiring layers to each other, and having a recess portion; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and an active surface of the semiconductor chip and including one or more redistribution layers electrically connecting the wiring layers and the connection pads to each other, in which the recess portion includes walls having different inclined angles.

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