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公开(公告)号：US20250048627A1
公开(公告)日：2025-02-06
申请号：US18427977
申请日：2024-01-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaehyeok Heo , Kyoung-Ho Kim , Hojun Lee , Sungsu Moon , Sea Hoon Lee , Jaeduk Lee , Junhee Lim
Abstract: Disclosed are semiconductor devices and electronic systems including the same. The semiconductor device includes a substrate that has a recess region, a gate electrode on a bottom surface of the recess region, a gate dielectric layer between the gate electrode and the bottom surface of the recess region, a plurality of shield electrodes on laterally opposite sides of the gate electrode and on inner sidewalls of the recess region, a plurality of dielectric patterns between the shield electrodes and the inner sidewalls of the recess region, a plurality of impurity regions in the substrate and on opposite sides of the shield electrodes, and a channel region in the substrate and below the bottom surface of the recess region.
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公开(公告)号：US10882285B2
公开(公告)日：2021-01-05
申请号：US15899804
申请日：2018-02-20
Applicant: Samsung Electronics Co., Ltd. , Daehyunst Co., Ltd.
Inventor： Younggyun Kim , Choontaek Shim , Sangil Hwang , Jeeyoung Oh , Hoyoung Lee , Jaeseon Jeon , Jaehyeok Heo
Abstract: A protective film for an electronic device is introduced. The protective film may comprises a deformable outer layer formed with a synthetic resin; a deformable modified material layer attached with a lower surface of the deformable outer layer, wherein the deformable modified layer is configured to be hardened responsive to receipt of an external stimuli; a deformable inner layer formed with a synthetic resin, attached with a lower surface of the deformable modified material layer; and an adhesive layer adhering to a lower surface of the deformable inner layer. Further, various embodiments can be implemented according to the present disclosure.
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