公开(公告)号：US12153812B2

公开(公告)日：2024-11-26

申请号：US18052285

申请日：2022-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Hoon Choi ,  Sang-Wan Nam ,  Sangyong Yoon ,  Kookhyun Cho

IPC: G06F3/06

Abstract: A memory package includes a printed circuit board, a first memory device that is stacked on the printed circuit board, and a second memory device stacked on the first memory device. The first memory device includes a first one-time programmable (OTP) block, the second memory device includes a second OTP block different from the first OTP block, and a horizontal distance from one side of the first memory device to the first OTP block is different from a horizontal distance from one side of the second memory device to the second OTP block.

公开(公告)号：US09871549B2

公开(公告)日：2018-01-16

申请号：US15236896

申请日：2016-08-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Min Kil ,  Jae-Hoon Choi ,  Li-Yeon Kang ,  Jin-Keun Park ,  Sang-Soo Lee ,  Min-Jong Lim ,  Dong-Sub Kim ,  Sang-Kyu Lee ,  Jong-Chul Choi ,  Chang-Ryong Heo

IPC: H04W4/00 ,  H04B1/3888

CPC classification number: H04B1/3888 ,  H04W4/80

Abstract: An electronic device, a protection device, and a method for protecting the electronic device with the protection device is provided. The electronic device includes a sensor module configured to detect a motion state of the electronic device when a cover is connected to the electronic device, and a processor configured to control an actuator of the cover based on the detected motion state of the electronic device.

公开(公告)号：US09819381B2

公开(公告)日：2017-11-14

申请号：US15292258

申请日：2016-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Chul Choi ,  Li-Yeon Kang ,  Kwangmin Gil ,  Jinkeun Park ,  Min-Woo Yoo ,  Sangsoo Lee ,  Min-Jong Lim ,  Jae-Hoon Choi ,  Chang-Ryong Heo ,  Dongsub Kim ,  Sangkyu Lee

IPC: H04B1/3888 ,  H04M1/18 ,  H04B1/38

CPC classification number: H04B1/3888 ,  H04B1/38 ,  H04M1/185

Abstract: An electronic device may include: at least one protective member disposed in at least one area of the electronic device; at least one sensor configured to detect the drop of the electronic device; a protective member driving module configured to activate the protective member to change the shape of the protective member according to whether the drop of the electronic device is detected; and at least one processor configured to receive a drop sensing signal detected by the sensor and to control the protective member driving module to change the shape of the protective member.

公开(公告)号：US20140000661A1

公开(公告)日：2014-01-02

申请号：US13840942

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-Soo Kim ,  Jae-Phil Boo ,  Kang-Min Paek ,  Keon-Sik Seo ,  Jae-Hoon Choi

IPC: H01L21/67

CPC classification number: H01L21/67034 ,  H01L21/67028

Abstract: An apparatus for drying a substrate may include a spin chuck, a drying chamber and a drying fluid line. The spin chuck may be configured to support the substrate. The spin chuck may rotate the substrate. The drying chamber may be configured to receive the spin chuck. The drying chamber may have an inlet, an outlet and a vortex exhaust. A drying fluid may be supplied through the inlet into the drying chamber. The drying fluid may be drained through the outlet. A vortex of the drying fluid may be drained through the vortex exhaust The drying fluid line may be connected to the inlet.

Abstract translation: 用于干燥基材的装置可以包括旋转卡盘，干燥室和干燥流体管线。 旋转卡盘可以被配置为支撑基板。 旋转卡盘可旋转基底。 干燥室可以构造成接收旋转卡盘。 干燥室可以具有入口，出口和涡流排气。 可以通过入口将干燥流体供应到干燥室中。 干燥流体可以通过出口排出。 干燥流体的涡流可以通过涡流排出物排出。干燥流体管线可以连接到入口。

公开(公告)号：US09887164B2

公开(公告)日：2018-02-06

申请号：US15417338

申请日：2017-01-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Hoon Choi ,  Dong-Woo Shin ,  Chang-Yong Park

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L24/08 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3025

Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate. The semiconductor package further includes an electromagnetic wave shielding member. The electromagnetic wave shielding member includes an upper surface and a plurality of side surfaces. The electromagnetic wave shielding member surrounds an upper surface and side surfaces of the semiconductor chip. The semiconductor package further includes a hooking member formed from a deformation of a lower end of one of the side surfaces of the electromagnetic wave shielding member. The hooking member is interposed between the semiconductor chip and the substrate to fix the electromagnetic wave shielding member.

公开(公告)号：US09620392B2

公开(公告)日：2017-04-11

申请号：US13840942

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-Soo Kim ,  Jae-Phil Boo ,  Kang-Min Paek ,  Keon-Sik Seo ,  Jae-Hoon Choi

IPC: H01L21/67

CPC classification number: H01L21/67034 ,  H01L21/67028

Abstract: An apparatus for drying a substrate may include a spin chuck, a drying chamber and a drying fluid line. The spin chuck may be configured to support the substrate. The spin chuck may rotate the substrate. The drying chamber may be configured to receive the spin chuck. The drying chamber may have an inlet, an outlet and a vortex exhaust. A drying fluid may be supplied through the inlet into the drying chamber. The drying fluid may be drained through the outlet. A vortex of the drying fluid may be drained through the vortex exhaust. The drying fluid line may be connected to the inlet.