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公开(公告)号:US20250151445A1
公开(公告)日:2025-05-08
申请号:US18742302
申请日:2024-06-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ingyu BAEK , Jinmyoung LEE , Soonhyung HONG
IPC: H01L27/146
Abstract: An image sensor that includes a first layer and a second layer bonded to the first layer. The first layer includes a first substrate including a first front surface and a first back surface, a floating diffusion region formed in the first substrate, a first pad, and a first conductive line provided between the floating diffusion region and the first pad. The second layer includes a second substrate including a second front surface and a second back surface, pixel transistors formed on the second substrate, a second pad, and a second conductive line provided between one of the pixel transistors and the second pad. The second conductive line passes through the second substrate and is electrically connected to a lower portion of the pixel transistor.
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公开(公告)号:US20240170530A1
公开(公告)日:2024-05-23
申请号:US18387702
申请日:2023-11-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ingyu BAEK , Changyong UM , Kwansik KIM , Jungsan KIM , Taemin KIM
IPC: H01G15/00 , H01L23/522 , H01L23/528 , H01L27/06
CPC classification number: H01L28/75 , H01L23/5226 , H01L23/5283 , H01L27/0629 , H01L28/90
Abstract: An integrated circuit device, including a substrate; a lower insulating film; and a capacitor structure including: a plurality of first conductive patterns sequentially stacked on the lower insulating film; a plurality of second conductive patterns on the plurality of first conductive patterns; a first via at a first side of the capacitor structure, wherein the first via physically contacts and is electrically connected to the plurality of first conductive patterns, and is not electrically connected to the plurality of second conductive patterns; and a second via at a second side of the capacitor structure, wherein the second via physically contacts and is electrically connected to the plurality of second conductive patterns, and is not electrically connected to the plurality of first conductive patterns.
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公开(公告)号:US20200058688A1
公开(公告)日:2020-02-20
申请号:US16390325
申请日:2019-04-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Doowon KWON , Ingyu BAEK
IPC: H01L27/146 , H01L27/148
Abstract: Disclosed is an image sensor comprising a first substrate including a plurality of pixels, a photoelectric conversion region in the first substrate at each of the pixels, a first capacitor on the first substrate, and a shield structure spaced apart from and surrounding the first capacitor.
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公开(公告)号:US20240205556A1
公开(公告)日:2024-06-20
申请号:US18534208
申请日:2023-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Heesung SHIM , Jaekyu LEE , Seungsik KIM , Ingyu BAEK
IPC: H04N25/51 , H04N25/42 , H04N25/59 , H04N25/616 , H04N25/771 , H04N25/778 , H04N25/78
CPC classification number: H04N25/51 , H04N25/42 , H04N25/59 , H04N25/616 , H04N25/771 , H04N25/778 , H04N25/78 , H04N25/7795
Abstract: An image sensor according to some example embodiments of the present inventive concepts may operate in a global shutter mode, and each pixel circuit may support a high conversion gain (HCG) mode and a low conversion gain (LCG) mode so as to have high dynamic range (HDR). Accordingly, the image sensor according to some example embodiments of the present inventive concepts may have HDR and may generate a high-quality image.
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公开(公告)号:US20140104923A1
公开(公告)日:2014-04-17
申请号:US14027337
申请日:2013-09-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ingyu BAEK , Yeong-Taek Lee , KyungMin Kim
IPC: G11C13/00
CPC classification number: G11C13/0069 , G11C13/0007 , G11C13/004
Abstract: Resistive memory driving methods are provided. The methods may include applying an operating voltage set according to a mode of operation to a selected word line among the plurality of word lines and a selected bit line among the plurality of bit lines within a line delay period.
Abstract translation: 提供了电阻式存储器驱动方法。 所述方法可以包括根据操作模式对在多个字线中的所选字线和行延迟周期内的多个位线中的选定位线之间施加设置的工作电压。
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