公开(公告)号：US20240170530A1

公开(公告)日：2024-05-23

申请号：US18387702

申请日：2023-11-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ingyu BAEK ,  Changyong UM ,  Kwansik KIM ,  Jungsan KIM ,  Taemin KIM

IPC: H01G15/00 ,  H01L23/522 ,  H01L23/528 ,  H01L27/06

CPC classification number: H01L28/75 ,  H01L23/5226 ,  H01L23/5283 ,  H01L27/0629 ,  H01L28/90

Abstract: An integrated circuit device, including a substrate; a lower insulating film; and a capacitor structure including: a plurality of first conductive patterns sequentially stacked on the lower insulating film; a plurality of second conductive patterns on the plurality of first conductive patterns; a first via at a first side of the capacitor structure, wherein the first via physically contacts and is electrically connected to the plurality of first conductive patterns, and is not electrically connected to the plurality of second conductive patterns; and a second via at a second side of the capacitor structure, wherein the second via physically contacts and is electrically connected to the plurality of second conductive patterns, and is not electrically connected to the plurality of first conductive patterns.

公开(公告)号：US20250098352A1

公开(公告)日：2025-03-20

申请号：US18968655

申请日：2024-12-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Su PARK ,  Kwansik KIM ,  Changhwa KIM ,  Taemin KIM ,  Gyuhyun LIM

IPC: H01L27/146

Abstract: An image sensor includes a substrate including a first surface and a second surface which is opposite to the first portion, and a pixel isolation portion provided in the substrate and configured to isolate unit pixels from each other. The pixel isolation portion includes a first filling insulation pattern extending from the first surface toward the second surface and having an air gap region, the first filling insulation pattern including a first sidewall and a second sidewall which is opposite to the first sidewall, a conductive structure including a first portion on the first sidewall, a second portion on the second sidewall, and a connection portion connecting the first portion and the second portion, and an insulating liner provided between the first portion and the substrate and between the second portion and the substrate.

公开(公告)号：US20210175286A1

公开(公告)日：2021-06-10

申请号：US17034316

申请日：2020-09-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangchun PARK ,  Kwansik KIM ,  Hongki KIM ,  Sangsu PARK ,  Beomsuk LEE ,  Taeyon LEE ,  Gwideok Ryan LEE

IPC: H01L27/30 ,  H01L27/146 ,  H01L51/44

Abstract: An image sensor includes a first substrate having a first surface and a second surface opposite to the first surface. The first substrate includes an active pixel, region having a plurality of active pixels. A plurality of lower electrode structures is disposed on the second surface of the first substrate and corresponds to the plurality of active pixels, An upper electrode is disposed on the plurality of lower electrode structures. An organic photoelectric conversion layer is disposed between the plurality of lower electrode structures and the upper electrode. A second substrate is disposed on the first surface of the first substrate. A driving circuit configured to drive the plurality of active pixels is disposed on the second substrate. The plurality of lower electrode structures includes a first barrier layer, a reflective layer disposed on the first barrier layer and a second barrier layer disposed on the reflective layer.