公开(公告)号：US09793147B2

公开(公告)日：2017-10-17

申请号：US15155578

申请日：2016-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kun-Jin Ryu ,  Hyun-Min Lee ,  Youn-Boo Jung ,  Sung-Hyun Jo

IPC: G05B13/00 ,  H01L21/677

CPC classification number: H01L21/67715 ,  G05D1/02

Abstract: A transporting system includes a first rail including a first region and a second region, the first region being a region where the first rail extends linearly and the second region being a region where the first rail is curved. A second rail includes a third region, separated from the first region, and a fourth region overlapping the second region, wherein the first and second rails merge at a joining location that includes the second region and the fourth region. Optical lines are disposed in the second region and the fourth region, wherein the optical lines are parallel to each other in the fourth region. A first transporting unit travels on the first rail. A second transporting unit travels on the second rail. A first controller controls the traveling of the first and second transporting units using light transmitted or received through the optical lines.

公开(公告)号：US10546876B2

公开(公告)日：2020-01-28

申请号：US16021775

申请日：2018-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Min Lee ,  Woo-Sung Yang ,  Kwan-Yong Kim

IPC: H01L27/11582 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11575

Abstract: Semiconductor devices are provided. A semiconductor device includes first and second stacks of electrodes. Moreover, the semiconductor device includes first and second connection lines that connect the first and second stacks of electrodes. In some embodiments, the first connection lines have a first length and the second connection lines have a second length that is longer than the first length of the first connection lines. In some embodiments, the first connection lines connect inner portions of the first stack of electrodes to inner portions of the second stack of electrodes. In some embodiments, the second connection lines connect outer portions of the first stack of electrodes to outer portions of the second stack of electrodes.

公开(公告)号：US20180308860A1

公开(公告)日：2018-10-25

申请号：US16021775

申请日：2018-06-28

Applicant: Samsung Electronics Co., Ltd

Inventor： Hyun-Min Lee ,  Woo-Sung Yang ,  Kwan-Yong Kim

IPC: H01L27/11582 ,  H01L27/11573 ,  H01L27/1157 ,  H01L27/11575

CPC classification number: H01L27/11582 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11575

Abstract: Semiconductor devices are provided. A semiconductor device includes first and second stacks of electrodes. Moreover, the semiconductor device includes first and second connection lines that connect the first and second stacks of electrodes. In some embodiments, the first connection lines have a first length and the second connection lines have a second length that is longer than the first length of the first connection lines. In some embodiments, the first connection lines connect inner portions of the first stack of electrodes to inner portions of the second stack of electrodes. In some embodiments, the second connection lines connect outer portions of the first stack of electrodes to outer portions of the second stack of electrodes.