公开(公告)号：US11456714B2

公开(公告)日：2022-09-27

申请号：US17154264

申请日：2021-01-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyosung Lee ,  Namjun Cho ,  Hyoseok Na ,  Hanyeop Lee

IPC: H03F3/24 ,  H01Q1/24 ,  H01Q21/06 ,  H03F1/56 ,  H04B1/00 ,  H04B1/40

Abstract: Various embodiments relate to an apparatus and a method for processing a radio signal in an electronic device. The electronic device may include: a communication processor; and a power amplifier electrically connected to the communication processor, the power amplifier including a first switch, an input port, a first output port, and a second output port, the power amplifier further including a first amplification circuit disposed on a first electrical path between the input port and the first switch, a second amplification circuit disposed on a second electrical path between the first switch and the first output port, and a third amplification circuit disposed on a third electrical path between the first switch and the second output port.

公开(公告)号：US11742597B2

公开(公告)日：2023-08-29

申请号：US16922327

申请日：2020-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hanyeop Lee ,  Jiyong Kim ,  Jongin Lee ,  Hyosung Lee ,  Namjun Cho ,  Ilpyo Hong ,  Hyoseok Na

IPC: H01Q21/28 ,  H01Q3/24 ,  H01Q21/06 ,  H04B1/16

CPC classification number: H01Q21/28 ,  H01Q3/24 ,  H01Q21/062 ,  H01Q21/065 ,  H04B1/1615

Abstract: A method and an apparatus for processing signals through Radio Frequency (RF) chains are provided. The electronic device includes a processor, a transceiver including a plurality of RF chains, a plurality of switches electrically connected to the plurality of RF chains, a first antenna array including a plurality of first antenna elements electrically connected to the plurality of switches, and a second antenna array including a plurality of second antenna elements electrically connected to the plurality of switches.

公开(公告)号：US11557842B2

公开(公告)日：2023-01-17

申请号：US17307598

申请日：2021-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Namjun Cho ,  Hyosung Lee ,  Hyoseok Na

IPC: H04B1/40 ,  H01Q3/30 ,  H01Q1/22 ,  H01Q15/00 ,  H01Q3/36

Abstract: In an antenna module on one printed circuit board, a first area where a plurality of antenna elements are positioned on a first surface, and a second area where a plurality of front end integrated circuits are independently positioned on a second surface, the opposite surface of the first surface, are provided, and a wire is provided in the second area to electrically couple some ports of a plurality of ports provided in a first front end integrated circuit to some ports of a plurality of ports provided in a second front end integrated circuit. The some ports provided in the first front end integrated circuit include a first port configured to output a first intermediate frequency signal, and a second port configured to input a second intermediate frequency signal.

公开(公告)号：US11336311B2

公开(公告)日：2022-05-17

申请号：US17011533

申请日：2020-09-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hanyeop Lee ,  Jooseung Kim ,  Jiyong Kim ,  Jongin Lee ,  Hyosung Lee ,  Ilpyo Hong ,  Hyoseok Na

IPC: H04B1/04 ,  H03F3/213 ,  H04B1/00 ,  H01Q3/24 ,  H01Q1/22 ,  H03F3/24

Abstract: Disclosed is an electronic device including an antenna module comprising a plurality of radio frequency (RF) chains, and a processor configured to control the antenna module, wherein each of the RF chains comprises an amplifier that amplifies power and a power detector, and wherein the antenna module further comprises a switching circuit that selectively switches between a first path and a second path, the first path being a connection through which an RF signal converted in the antenna module is transmitted to the power detector causing the RF signal to be detected, and the second path being a connection through which the RF signal is transmitted to the amplifier causing the power detector to detect an RF signal of the amplifier.

公开(公告)号：US11462821B2

公开(公告)日：2022-10-04

申请号：US17209499

申请日：2021-03-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hanyeop Lee ,  Hyosung Lee ,  Namjun Cho ,  Donghyun Kim ,  Hyoseok Na

IPC: H01Q1/24 ,  H04B1/04 ,  H04B1/18

Abstract: According to various embodiments of the disclosure, a portable communication device may include: a processor, a communication circuit, at least one first type antenna circuitry, and at least one second type antenna circuitry, wherein the at least one first type antenna circuitry may include an antenna array configured to transmit and/or receive a signal, a power amplifier configured to amplify a transmit signal and a low noise amplifier configured to amplify a received signal, the at least one second type antenna circuitry may include an antenna array configured to receive a signal and a low noise amplifier configured to amplify a received signal, the at least one second type antenna circuitry not including a power amplifier for amplifying a transmit signal, wherein the processor may be configured to control the portable communication device to transmit a transmit signal through the at least one first type antenna circuitry, and to receive a receive signal through at least one selected from the at least one first type antenna circuitry and the at least one second type antenna circuitry.

公开(公告)号：US10971799B2

公开(公告)日：2021-04-06

申请号：US16943096

申请日：2020-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yousung Lee ,  Hyosung Lee ,  Namjun Cho ,  Hyoseok Na

IPC: H01Q21/00 ,  H01Q1/22 ,  H01Q3/34 ,  H01Q21/06 ,  H01Q5/10

Abstract: An electronic device is provided. The electronic device includes an antenna module including an antenna array. The antenna module includes a printed circuit board, conductive lines formed on the printed circuit board, each of the conductive lines having different lengths, a communication circuit including a first switch connected to ends of the conductive lines, and a front-end including a second switch connected to opposite ends of the conductive lines and phase shifters connected to the second switch. Based on a direction of a beam to be formed by the antenna array, a processor connected to the antenna module is configured to control the first switch and the second switch to select at least one of the conductive lines and to control a phase value of at least one of the phase shifters connected to the selected conductive line, based on a length of the selected conductive line.

公开(公告)号：US10381361B2

公开(公告)日：2019-08-13

申请号：US15455600

申请日：2017-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suk Koo Hong ,  Miyeong Kang ,  Hyosung Lee ,  Kyoungyong Cho ,  Sunkak Jo

IPC: G03F7/00 ,  H01L27/11548 ,  H01L21/311 ,  H01L21/027 ,  H01L27/11556 ,  H01L27/11582 ,  H01L27/11575 ,  G03F7/038 ,  G03F7/40 ,  G03F7/004 ,  G03F7/039 ,  G03F7/075

Abstract: Embodiments of the inventive concepts provide a method for manufacturing a semiconductor device. The method includes forming a stack structure including insulating layers and sacrificial layers which are alternately and repeatedly stacked on a substrate. A first photoresist pattern is formed on the stack structure. A first part of the stack structure is etched to form a stepwise structure using the first photoresist pattern as an etch mask. The first photoresist pattern includes a copolymer including a plurality of units represented by at least one of the following chemical formulas 1 to 3, wherein “R1”, “R2”, “R3”, “p”, “q” and “r” are the same as defined in the description.

公开(公告)号：US10319735B2

公开(公告)日：2019-06-11

申请号：US15455667

申请日：2017-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suk Koo Hong ,  Miyeong Kang ,  Hyosung Lee ,  Kyoungyong Cho ,  Bora Kim ,  Hyeji Kim ,  Sunkak Jo

IPC: H01L21/311 ,  H01L27/11582 ,  H01L21/28 ,  H01L27/11556 ,  G03F7/039 ,  G03F7/075 ,  G03F7/09 ,  H01L21/027 ,  H01L27/11565 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11575

Abstract: Embodiments of the inventive concept provide a method for manufacturing a semiconductor device. The method includes forming a stack structure by alternately and repeatedly stacking insulating layers and sacrificial layers on a substrate, sequentially forming a first lower layer and a first photoresist pattern on the stack structure, etching the first lower layer using the first photoresist pattern as an etch mask to form a first lower pattern. A first part of the stack structure is etched to form a stepwise structure using the first lower pattern as an etch mask. The first lower layer includes a novolac-based organic polymer, and the first photoresist pattern includes a polymer including silicon.