公开(公告)号：US11445637B2

公开(公告)日：2022-09-13

申请号：US16763074

申请日：2018-08-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chung-Hyo Jung ,  Kang-Sik Kim ,  Young-San Kim ,  Won-Min Kim ,  Chi-Hyun Cho

IPC: H05K7/20 ,  H01L23/552 ,  H05K9/00

Abstract: According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

公开(公告)号：US11700711B2

公开(公告)日：2023-07-11

申请号：US17882418

申请日：2022-08-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chung-Hyo Jung ,  Kang-Sik Kim ,  Young-San Kim ,  Won-Min Kim ,  Chi-Hyun Cho

IPC: H05K7/20 ,  H01L23/552 ,  H05K1/02 ,  H05K1/18 ,  H05K9/00

CPC classification number: H05K7/20436 ,  H01L23/552 ,  H05K1/0209 ,  H05K1/181 ,  H05K7/205 ,  H05K9/00 ,  H05K9/0024 ,  H05K2201/064

Abstract: According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.

公开(公告)号：US11231763B2

公开(公告)日：2022-01-25

申请号：US16466089

申请日：2017-12-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Min Lee ,  Kwang-Eun Go ,  Kang-Sik Kim ,  Dong-Sub Kim ,  Young-San Kim ,  Won-Min Kim ,  Young-Hyun Ban ,  Min-Woo Song ,  Chung-Hyo Jung

IPC: G06F1/08 ,  G06F1/20 ,  G06F1/32 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3234

Abstract: Various embodiments of the present invention relate to an electronic device and a method for controlling heat generated on the surface of the electronic device. The electronic device may comprise a display and a processor, wherein the processor: displays, on the display, graphic elements at the request of a first application; during a first period of time, acquires first information corresponding to the graphic performance of the displayed graphic elements, and identifies a clock control level for controlling operation performance according to execution of the first application; and during a second period of time following the first period of time, identifies a clock value corresponding to the identified clock control level on the basis of the acquired first information, and controls the operation performance according to execution of the first application by using the identified clock value.

公开(公告)号：US20160029511A1

公开(公告)日：2016-01-28

申请号：US14809094

申请日：2015-07-24

Applicant: Samsung Electronics Co., Ltd ,  TTM Co., Ltd

Inventor： Chung-Hyo Jung ,  Eu-Gene Choi ,  Bong-Jae Rhee

IPC: H05K7/20 ,  F28F23/00 ,  F28F21/00

CPC classification number: F28F23/00 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/427 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat transfer apparatus is provided. The heat transfer apparatus includes a first thermal conductor. The heat transfer apparatus also includes a second thermal conductor. The heat transfer apparatus further includes an interface member configured to transfer heat between the first thermal conductor and the second thermal conductor. A portion of the interface member contains a thermoplastic material reacting via an application of the heat.

Abstract translation: 提供传热装置。 传热装置包括第一热导体。 传热装置还包括第二热导体。 传热装置还包括被配置为在第一热导体和第二热导体之间传递热量的界面构件。 界面部件的一部分包含通过施加热量而反应的热塑性材料。