Invention Grant
- Patent Title: Electronic device comprising heat radiating structure
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Application No.: US17882418Application Date: 2022-08-05
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Publication No.: US11700711B2Publication Date: 2023-07-11
- Inventor: Chung-Hyo Jung , Kang-Sik Kim , Young-San Kim , Won-Min Kim , Chi-Hyun Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye, P.C.
- Priority: KR 20170149637 2017.11.10
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/552 ; H05K1/02 ; H05K1/18 ; H05K9/00

Abstract:
According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.
Public/Granted literature
- US20220377875A1 ELECTRONIC DEVICE COMPRISING HEAT RADIATING STRUCTURE Public/Granted day:2022-11-24
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