公开(公告)号：US09048168B2

公开(公告)日：2015-06-02

申请号：US14083733

申请日：2013-11-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heung-kyu Kwon ,  Seok-won Lee ,  Hyon-chol Kim ,  Su-chang Lee ,  Chi-young Lee

IPC: H01L23/02 ,  H01L23/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H01L25/00 ,  H01L21/66 ,  H01L23/31

CPC classification number: H01L24/17 ,  H01L22/12 ,  H01L22/20 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/00 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package can include a substrate body having a first surface and a second surface. A semiconductor chip can be mounted on the first surface and a plurality of electrode pads can be on the second surface and selectively formed to have progressively smaller or larger sizes extending from a central region of the substrate body toward an outer edge of the substrate body based on a reflow soldering process warpage profile for the semiconductor package.

Abstract translation: 半导体封装可以包括具有第一表面和第二表面的衬底本体。 半导体芯片可以安装在第一表面上，并且多个电极焊盘可以在第二表面上并且选择性地形成为具有从基板主体的中心区域朝向基板主体的外边缘延伸的逐渐变小或更大的尺寸 在半导体封装的回流焊工艺翘曲曲线上。

公开(公告)号：US20140077382A1

公开(公告)日：2014-03-20

申请号：US14083733

申请日：2013-11-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heung-kyu Kwon ,  Seok-won Lee ,  Hyon-chol Kim ,  Su-chang Lee ,  Chi-young Lee

IPC: H01L23/00 ,  H01L25/00

CPC classification number: H01L24/17 ,  H01L22/12 ,  H01L22/20 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/00 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package can include a substrate body having a first surface and a second surface. A semiconductor chip can be mounted on the first surface and a plurality of electrode pads can be on the second surface and selectively formed to have progressively smaller or larger sizes extending from a central region of the substrate body toward an outer edge of the substrate body based on a reflow soldering process warpage profile for the semiconductor package.

Abstract translation: 半导体封装可以包括具有第一表面和第二表面的衬底本体。 半导体芯片可以安装在第一表面上，并且多个电极焊盘可以在第二表面上并且选择性地形成为具有从基板主体的中心区域朝向基板主体的外边缘延伸的逐渐变小或更大的尺寸 在半导体封装的回流焊工艺翘曲曲线上。