公开(公告)号：US20160253187A1

公开(公告)日：2016-09-01

申请号：US15056190

申请日：2016-02-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Wook KIM ,  Hee Deog Kim ,  Moo Young Kim ,  Hak Ryoul Kim ,  Jin Goo Lee ,  Rae Jin Uh ,  Ju Beam Lee

IPC: G06F9/445

CPC classification number: G06F9/44505 ,  G06F1/3212 ,  G06F1/3215 ,  G06F1/325 ,  G06F1/329 ,  H04W52/0258 ,  Y02D10/174 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/164 ,  Y02D70/166 ,  Y02D70/168 ,  Y02D70/26

Abstract: An electronic device and a method of application control by an electronic device are provided. The electronic device includes a memory configured to store a first application list including an application installed in the electronic device; and a processor configured to update the first application list according to at least one of an operation of the application, use history of the application, and a user request, and to limit the operation of the application.

Abstract translation: 提供电子设备和电子设备的应用控制方法。 电子设备包括被配置为存储包括安装在电子设备中的应用的第一应用列表的存储器; 以及处理器，被配置为根据应用的操作，应用的使用历史和用户请求中的至少一个来更新第一应用列表，并且限制应用的操作。

公开(公告)号：US20200028376A1

公开(公告)日：2020-01-23

申请号：US16587204

申请日：2019-09-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Mi HA ,  Gil Young NOH ,  Byung Wook KIM ,  Jung Min LEE ,  Jae Mu HA

IPC: H02J7/02 ,  H02J50/12 ,  H02J50/20 ,  H01M10/48 ,  H05K5/00 ,  H02J7/00 ,  H02J50/80 ,  H02J50/90 ,  H02J50/10

Abstract: An electronic device is disclosed. The disclosed electronic device includes a display, a charging circuit that transmits and receives power to and from an external electronic device, a sensor circuit that senses a spatial relationship of the electronic device with the external electronic device, a processor that is electrically connected with the display, the charging circuit, and the sensor circuit. When wirelessly transmitting or receiving power to or from the external electronic device using the charging circuit, the processor may transmit and receive information associated with the wireless transmission or reception of power and display the information based on the spatial relationship.

公开(公告)号：US20180123379A1

公开(公告)日：2018-05-03

申请号：US15800278

申请日：2017-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Mi HA ,  Gil Young NOH ,  Byung Wook KIM ,  Jung Min LEE ,  Jae Mu HA

IPC: H02J7/02 ,  H05K5/00 ,  H02J50/12 ,  H02J50/20 ,  H01M10/48

CPC classification number: H02J7/025 ,  H01M10/488 ,  H02J7/0047 ,  H02J7/0054 ,  H02J50/10 ,  H02J50/12 ,  H02J50/20 ,  H02J50/80 ,  H02J50/90 ,  H05K5/0017

Abstract: An electronic device is disclosed. The disclosed electronic device includes a display, a charging circuit that transmits and receives power to and from an external electronic device, a sensor circuit that senses a spatial relationship of the electronic device with the external electronic device, a processor that is electrically connected with the display, the charging circuit, and the sensor circuit. When wirelessly transmitting or receiving power to or from the external electronic device using the charging circuit, the processor may transmit and receive information associated with the wireless transmission or reception of power and display the information based on the spatial relationship.

公开(公告)号：US20230067356A1

公开(公告)日：2023-03-02

申请号：US17853116

申请日：2022-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Wook KIM ,  A-Young KIM ,  Seong Won JEONG ,  Sang Su HA

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: A semiconductor package capable of reducing or preventing cracks from occurring in a conductive bump and a method for manufacturing the same. The semiconductor package includes a semiconductor chip; a first conductive bump; a first re-distribution layer which is provided between the semiconductor chip and the first conductive bump and electrically connects the semiconductor chip and the first conductive bump; and a buffer structure which formed to fill up a space between a side surface of the first conductive bump and one surface of the first re-distribution layer, in which the buffer structure includes a plurality of pores.

公开(公告)号：US20160062326A1

公开(公告)日：2016-03-03

申请号：US14840983

申请日：2015-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Yong BANG ,  Byung Wook KIM ,  Ju Beam LEE ,  Moo Young KIM

IPC: G05B13/02 ,  G06F1/08

CPC classification number: G05B13/026 ,  G06F1/08 ,  G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3265 ,  Y02D10/126 ,  Y02D10/153

Abstract: An electronic device, a method of controlling performance of the electronic device, and a chipset thereof is provided. The electronic device includes a sensor module configured to measure an internal temperature of the electronic device, a surface temperature predicting module to predict a surface temperature of the electronic device using the measured internal temperature, and a processor to control at least a portion of performance of the electronic device based on the predicted surface temperature. The method includes measuring an internal temperature of the electronic device; predicting a surface temperature of the electronic device using the measured internal temperature; and controlling at least a portion of performance of the electronic device based on the predicted surface temperature.

Abstract translation: 提供电子设备，电子设备的性能控制方法及其芯片组。 电子设备包括被配置为测量电子设备的内部温度的传感器模块，表面温度预测模块，用于使用所测量的内部温度来预测电子设备的表面温度;以及处理器，用于控制电子设备的性能的至少一部分 电子装置基于预测的表面温度。 该方法包括测量电子设备的内部温度; 使用测量的内部温度预测电子设备的表面温度; 以及基于预测的表面温度来控制电子设备的至少一部分性能。