公开(公告)号：US20160062326A1

公开(公告)日：2016-03-03

申请号：US14840983

申请日：2015-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Yong BANG ,  Byung Wook KIM ,  Ju Beam LEE ,  Moo Young KIM

IPC: G05B13/02 ,  G06F1/08

CPC classification number: G05B13/026 ,  G06F1/08 ,  G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3265 ,  Y02D10/126 ,  Y02D10/153

Abstract: An electronic device, a method of controlling performance of the electronic device, and a chipset thereof is provided. The electronic device includes a sensor module configured to measure an internal temperature of the electronic device, a surface temperature predicting module to predict a surface temperature of the electronic device using the measured internal temperature, and a processor to control at least a portion of performance of the electronic device based on the predicted surface temperature. The method includes measuring an internal temperature of the electronic device; predicting a surface temperature of the electronic device using the measured internal temperature; and controlling at least a portion of performance of the electronic device based on the predicted surface temperature.

Abstract translation: 提供电子设备，电子设备的性能控制方法及其芯片组。 电子设备包括被配置为测量电子设备的内部温度的传感器模块，表面温度预测模块，用于使用所测量的内部温度来预测电子设备的表面温度;以及处理器，用于控制电子设备的性能的至少一部分 电子装置基于预测的表面温度。 该方法包括测量电子设备的内部温度; 使用测量的内部温度预测电子设备的表面温度; 以及基于预测的表面温度来控制电子设备的至少一部分性能。