公开(公告)号：US20230067356A1

公开(公告)日：2023-03-02

申请号：US17853116

申请日：2022-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Wook KIM ,  A-Young KIM ,  Seong Won JEONG ,  Sang Su HA

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: A semiconductor package capable of reducing or preventing cracks from occurring in a conductive bump and a method for manufacturing the same. The semiconductor package includes a semiconductor chip; a first conductive bump; a first re-distribution layer which is provided between the semiconductor chip and the first conductive bump and electrically connects the semiconductor chip and the first conductive bump; and a buffer structure which formed to fill up a space between a side surface of the first conductive bump and one surface of the first re-distribution layer, in which the buffer structure includes a plurality of pores.