Display device and method of manufacturing the same

    公开(公告)号:US11825613B2

    公开(公告)日:2023-11-21

    申请号:US17493910

    申请日:2021-10-05

    CPC classification number: H05K3/4679 H05K1/144 H05K2201/10128 H05K2203/104

    Abstract: A method includes preparing a substrate including a display area and a non-display area disposed adjacent to the display area, forming first panel magnetic patterns overlapping the non-display area and extending in a first direction on the substrate, forming first film magnetic patterns extending in the first direction on a film, inputting a first magnetism to the first panel magnetic patterns so that the first panel magnetic patterns have a first magnetic property, inputting a second magnetism to the first film magnetic patterns so that the first film magnetic patterns have a second magnetic property, and aligning the film on the substrate so that the first film magnetic patterns overlap the first panel magnetic patterns in a plan view.

    Substrate fixing device, deposition processing equipment including the same, and deposition processing method using the deposition processing equipment

    公开(公告)号:US11767588B2

    公开(公告)日:2023-09-26

    申请号:US17196386

    申请日:2021-03-09

    Inventor: Junyoung Lee

    CPC classification number: C23C14/3464 C23C14/042 C23C14/505

    Abstract: A substrate fixing device includes a first supporter supporting at least one substrate and a second supporter connected to the first supporter, making contact with a first surface and a second surface of the at least one substrate in a first direction, and vertically fixing the at least one substrate such that a third surface faces a normal line direction of the first supporter. The second supporter defines a deposition surface including the third surface, a portion of the first surface adjacent to the third surface, and a portion of the second surface adjacent to the third surface in the at least one substrate and exposes the defined deposition surface to the deposition processing space. A deposition processing equipment including the substrate fixing device and a deposition processing method using the deposition processing equipment are also provided.

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