Display device
    1.
    发明授权

    公开(公告)号:US11871630B2

    公开(公告)日:2024-01-09

    申请号:US18062804

    申请日:2022-12-07

    CPC classification number: H10K59/131 H10K50/844 H10K59/40

    Abstract: A display device includes a base layer, a pixel disposed on the base layer, a signal line electrically connected to the pixel, a signal pad connected to the signal line, and a plurality of insulating layers disposed on the base layer. The signal pad includes a first conductive pattern connected to an end portion of the signal line, a second conductive pattern connected to the first conductive pattern, and at least one insulating pattern disposed between the end portion of the signal line and the second conductive pattern in a cross-sectional view and overlapping the second conductive pattern in a plan view.

    DISPLAY DEVICE
    3.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20230247874A1

    公开(公告)日:2023-08-03

    申请号:US18062804

    申请日:2022-12-07

    CPC classification number: H01L27/3276 H01L27/323 H01L51/5253

    Abstract: A display device includes a base layer, a pixel disposed on the base layer, a signal line electrically connected to the pixel, a signal pad connected to the signal line, and a plurality of insulating layers disposed on the base layer. The signal pad includes a first conductive pattern connected to an end portion of the signal line, a second conductive pattern connected to the first conductive pattern, and at least one insulating pattern disposed between the end portion of the signal line and the second conductive pattern in a cross-sectional view and overlapping the second conductive pattern in a plan view.

    Display device and method of manufacturing the same

    公开(公告)号:US12243844B2

    公开(公告)日:2025-03-04

    申请号:US17717567

    申请日:2022-04-11

    Abstract: A display device includes a substrate including a display area and a pad area, a plurality of pad electrodes disposed in the pad area on the substrate, a circuit board disposed to overlap at least a portion of the pad area on the substrate, and an anisotropic conductive layer disposed in the pad area between the substrate and the circuit board. The circuit board includes a base substrate and a plurality of bump electrodes disposed on a lower surface of the base substrate. The anisotropic conductive layer includes an adhesive layer and a plurality of conductive particles arranged in the adhesive layer. Each of the conductive particles includes a core, a first conductive film disposed on the core in a way such that at least a portion of the core is exposed, and a second conductive film entirely covering the core and the first conductive film.

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