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公开(公告)号:US11871630B2
公开(公告)日:2024-01-09
申请号:US18062804
申请日:2022-12-07
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Kikyung Youk , Hanbum Kwon , Seung-Soo Ryu , Heeju Woo , Cholong Won , Daehyuk Im , Sun Oh Jeong
IPC: H10K59/131 , H10K59/40 , H10K50/844
CPC classification number: H10K59/131 , H10K50/844 , H10K59/40
Abstract: A display device includes a base layer, a pixel disposed on the base layer, a signal line electrically connected to the pixel, a signal pad connected to the signal line, and a plurality of insulating layers disposed on the base layer. The signal pad includes a first conductive pattern connected to an end portion of the signal line, a second conductive pattern connected to the first conductive pattern, and at least one insulating pattern disposed between the end portion of the signal line and the second conductive pattern in a cross-sectional view and overlapping the second conductive pattern in a plan view.
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公开(公告)号:US12080662B2
公开(公告)日:2024-09-03
申请号:US17316716
申请日:2021-05-11
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Eui Jeong Kang , Sanghyeon Song , Heeju Woo , Donghyun Lee
IPC: H01L23/00 , H10K59/131
CPC classification number: H01L24/05 , H01L24/02 , H01L24/04 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/83 , H10K59/131 , H01L2224/02181 , H01L2224/02185 , H01L2224/04026 , H01L2224/05073 , H01L2224/05124 , H01L2224/05139 , H01L2224/05147 , H01L2224/05166 , H01L2224/0518 , H01L2224/05551 , H01L2224/05553 , H01L2224/05564 , H01L2224/05573 , H01L2224/05686 , H01L2224/0569 , H01L2224/05693 , H01L2224/29499 , H01L2224/32227 , H01L2224/32238 , H01L2224/331 , H01L2224/83048 , H01L2224/83191 , H01L2224/83192 , H01L2224/83201 , H01L2224/8322 , H01L2224/83951
Abstract: The invention relates to display device and method of manufacturing the same. The display device includes: a substrate; a driving pad disposed on the substrate; an insulating layer exposing the driving pad and disposed on the substrate; a circuit board including a circuit pad overlapping the driving pad; and a connector disposed between the circuit board and the insulating layer and including a plurality of conductive particles electrically connecting the driving pad and the circuit pad, the driving pad including: a first pad disposed on the substrate; and a second pad disposed on the first pad and having an opening exposing the first pad.
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公开(公告)号:US20230247874A1
公开(公告)日:2023-08-03
申请号:US18062804
申请日:2022-12-07
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Kikyung Youk , Hanbum Kwon , Seung-soo Ryu , Heeju Woo , Cholong Won , Daehyuk Im , Sun Oh Jeong
IPC: H10K59/131 , H10K59/40 , H10K50/844
CPC classification number: H01L27/3276 , H01L27/323 , H01L51/5253
Abstract: A display device includes a base layer, a pixel disposed on the base layer, a signal line electrically connected to the pixel, a signal pad connected to the signal line, and a plurality of insulating layers disposed on the base layer. The signal pad includes a first conductive pattern connected to an end portion of the signal line, a second conductive pattern connected to the first conductive pattern, and at least one insulating pattern disposed between the end portion of the signal line and the second conductive pattern in a cross-sectional view and overlapping the second conductive pattern in a plan view.
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公开(公告)号:US11552155B2
公开(公告)日:2023-01-10
申请号:US16944707
申请日:2020-07-31
Applicant: Samsung Display Co., Ltd.
Inventor: Chan-Jae Park , Sangduk Lee , Heeju Woo , Kikyung Youk , Hyun a Lee , Daehwan Jang
Abstract: A method for manufacturing a display device includes providing an electronic component between a plurality of bumps, providing a display panel, aligning the electronic component and the display panel, and applying ultrasonic waves to bond the plurality of bumps to signal pads. In providing first adhesive members, at least a portion of a top surface of each of the plurality of bumps is exposed between the first adhesive members.
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公开(公告)号:US12243844B2
公开(公告)日:2025-03-04
申请号:US17717567
申请日:2022-04-11
Applicant: Samsung Display Co., Ltd.
Inventor: Byoungyong Kim , Daehyuk Im , Seung-Soo Ryu , Heeju Woo
Abstract: A display device includes a substrate including a display area and a pad area, a plurality of pad electrodes disposed in the pad area on the substrate, a circuit board disposed to overlap at least a portion of the pad area on the substrate, and an anisotropic conductive layer disposed in the pad area between the substrate and the circuit board. The circuit board includes a base substrate and a plurality of bump electrodes disposed on a lower surface of the base substrate. The anisotropic conductive layer includes an adhesive layer and a plurality of conductive particles arranged in the adhesive layer. Each of the conductive particles includes a core, a first conductive film disposed on the core in a way such that at least a portion of the core is exposed, and a second conductive film entirely covering the core and the first conductive film.
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公开(公告)号:US11135779B2
公开(公告)日:2021-10-05
申请号:US16886993
申请日:2020-05-29
Applicant: Samsung Display Co., Ltd.
Inventor: Hyun a Lee , Chan-Jae Park , Heeju Woo , Kikyung Youk , Sangduk Lee , Daehwan Jang
Abstract: An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.
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