Flexible display device
    1.
    发明授权

    公开(公告)号:US10367165B2

    公开(公告)日:2019-07-30

    申请号:US14979344

    申请日:2015-12-22

    Inventor: Jin Sic Min

    Abstract: A flexible display device according to an example embodiment includes: a substrate; a driver integrated circuit (IC) in a non-display portion of the substrate and configured to supply a driving voltage to a display portion of the substrate; a flexible printed circuit board attached to the non-display portion at an outer side of the driver IC; and a printed circuit board attached to the flexible printed circuit board and configured to transfer the driving voltage to the driver IC, wherein the driver IC comprises a base layer, a plurality of bumps at a bottom surface of the base layer, a first layer at an upper surface of the base layer, and second layers at the first layer to correspond to locations of the plurality of bumps.

    DISPLAY DEVICE HAVING ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    DISPLAY DEVICE HAVING ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF 有权
    具有各向异性导电膜的显示装置及其制造方法

    公开(公告)号:US20150108436A1

    公开(公告)日:2015-04-23

    申请号:US14265737

    申请日:2014-04-30

    Abstract: A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.

    Abstract translation: 显示装置包括:基板,具有布线部,设置在基板上并从布线部延伸的焊盘单元,与焊盘单元电连接并安装在基板上的集成电路芯片;以及各向异性导电膜, 垫单元和集成芯片彼此相连。 各向异性导电膜包括设置在焊盘单元和集成电路芯片之间的粘合剂层和在粘合剂层中散布的至少一个导电球。 在基板上还设有发热体。 发热体构成为与各向异性导电膜接触,向各向异性导电膜供给热量。

    Bonded assembly and display device including the same

    公开(公告)号:US10178769B2

    公开(公告)日:2019-01-08

    申请号:US15581923

    申请日:2017-04-28

    Abstract: A bonded assembly including: a first electronic component including a first substrate and a plurality of first electrodes disposed in a pressed area at a first height from a surface of the first substrate; a second electronic component including a second substrate and a plurality of second electrodes disposed at a second height from a surface of the second substrate, a second electrode overlapping with a corresponding first electrode to face the first electrode; a conductive bonding layer disposed between the first electrode and the second electrode overlapped with each other to bond the first electrode and the second electrode; and at least one spacer disposed between the first substrate and the second substrate to overlap the pressed area, the at least one spacer having a thickness that is greater than a value obtained by summing the first height and the second height.

    FLEXIBLE DISPLAY DEVICE
    4.
    发明申请
    FLEXIBLE DISPLAY DEVICE 审中-公开
    柔性显示装置

    公开(公告)号:US20160307512A1

    公开(公告)日:2016-10-20

    申请号:US14979344

    申请日:2015-12-22

    Inventor: Jin Sic Min

    Abstract: A flexible display device according to an example embodiment includes: a substrate; a driver integrated circuit (IC) in a non-display portion of the substrate and configured to supply a driving voltage to a display portion of the substrate; a flexible printed circuit board attached to the non-display portion at an outer side of the driver IC; and a printed circuit board attached to the flexible printed circuit board and configured to transfer the driving voltage to the driver IC, wherein the driver IC comprises a base layer, a plurality of bumps at a bottom surface of the base layer, a first layer at an upper surface of the base layer, and second layers at the first layer to correspond to locations of the plurality of bumps.

    Abstract translation: 根据示例实施例的柔性显示装置包括:基板; 在所述衬底的非显示部分中的驱动器集成电路(IC),并且被配置为向所述衬底的显示部分提供驱动电压; 柔性印刷电路板,其安装在驱动器IC的外侧的非显示部分; 以及印刷电路板,其附接到所述柔性印刷电路板并且被配置为将所述驱动电压传递到所述驱动器IC,其中所述驱动器IC包括基底层,在所述基底层的底表面处的多个凸起, 基层的上表面,以及第一层处的第二层,以对应于多个凸块的位置。

    Adhesive attaching apparatus, method of manufacturing display device using the same, and display device manufactured by the same

    公开(公告)号:US11309272B2

    公开(公告)日:2022-04-19

    申请号:US16897380

    申请日:2020-06-10

    Abstract: A method of manufacturing a display device, includes: providing an adhesive tape including: an adhesive conductive layer on a base film, a cutting width corresponding to a width of an adhesive tape attaching area of a substrate and provided in plurality including cutting widths adjacent to each other along the base film, and an interval between the cutting widths adjacent to each other; within the interval, providing a plurality of half-cuts in the adhesive tape, to provide a multi-cut adhesive tape; and pressing the multi-cut adhesive tape to the substrate, at a first portion of the multi-cut adhesive tape which corresponds to the cutting width, to separate the first portion of the multi-cut adhesive tape from the base film and attach the first portion of the multi-cut adhesive tape to the substrate at the adhesive tape attaching area thereof.

    Display device having anisotropic conductive film and manufacturing method thereof
    6.
    发明授权
    Display device having anisotropic conductive film and manufacturing method thereof 有权
    具有各向异性导电膜的显示装置及其制造方法

    公开(公告)号:US09142602B2

    公开(公告)日:2015-09-22

    申请号:US14265737

    申请日:2014-04-30

    Abstract: A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.

    Abstract translation: 显示装置包括:基板,具有布线部,设置在基板上并从布线部延伸的焊盘单元,与焊盘单元电连接并安装在基板上的集成电路芯片;以及各向异性导电膜, 垫单元和集成芯片彼此相连。 各向异性导电膜包括设置在焊盘单元和集成电路芯片之间的粘合剂层和在粘合剂层中散布的至少一个导电球。 在基板上还设有发热体。 发热体构成为与各向异性导电膜接触,向各向异性导电膜供给热量。

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