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1.发明申请DISPLAY DEVICE HAVING ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF 有权具有各向异性导电膜的显示装置及其制造方法公开(公告)号：US20150108436A1
公开(公告)日：2015-04-23
申请号：US14265737
申请日：2014-04-30
Applicant: Samsung Display Co., Ltd.
Inventor： Jin Sic Min , Dae Geun Lee , Sang Urn Lim , Eu Tteum Kim
CPC classification number: H01L27/3276 , H01L27/3255 , H01L51/524 , H01L51/529 , H01L51/56 , H01L2227/323 , H01L2251/5369
Abstract: A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.
Abstract translation: 显示装置包括：基板，具有布线部，设置在基板上并从布线部延伸的焊盘单元，与焊盘单元电连接并安装在基板上的集成电路芯片;以及各向异性导电膜， 垫单元和集成芯片彼此相连。 各向异性导电膜包括设置在焊盘单元和集成电路芯片之间的粘合剂层和在粘合剂层中散布的至少一个导电球。 在基板上还设有发热体。 发热体构成为与各向异性导电膜接触，向各向异性导电膜供给热量。
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2.发明授权Display device having anisotropic conductive film and manufacturing method thereof 有权具有各向异性导电膜的显示装置及其制造方法公开(公告)号：US09142602B2
公开(公告)日：2015-09-22
申请号：US14265737
申请日：2014-04-30
Applicant: Samsung Display Co., Ltd.
Inventor： Jin Sic Min , Dae Geun Lee , Sang Urn Lim , Eu Tteum Kim
CPC classification number: H01L27/3276 , H01L27/3255 , H01L51/524 , H01L51/529 , H01L51/56 , H01L2227/323 , H01L2251/5369
Abstract: A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.
Abstract translation: 显示装置包括：基板，具有布线部，设置在基板上并从布线部延伸的焊盘单元，与焊盘单元电连接并安装在基板上的集成电路芯片;以及各向异性导电膜， 垫单元和集成芯片彼此相连。 各向异性导电膜包括设置在焊盘单元和集成电路芯片之间的粘合剂层和在粘合剂层中散布的至少一个导电球。 在基板上还设有发热体。 发热体构成为与各向异性导电膜接触，向各向异性导电膜供给热量。
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