公开(公告)号：US10178769B2

公开(公告)日：2019-01-08

申请号：US15581923

申请日：2017-04-28

Applicant: Samsung Display Co., Ltd.

Inventor： Jin Sic Min ,  Eun Cheol Son

IPC: H05K1/11 ,  H05K1/14 ,  H01L23/00 ,  H05K1/02 ,  H05K3/36 ,  H05K3/32

Abstract: A bonded assembly including: a first electronic component including a first substrate and a plurality of first electrodes disposed in a pressed area at a first height from a surface of the first substrate; a second electronic component including a second substrate and a plurality of second electrodes disposed at a second height from a surface of the second substrate, a second electrode overlapping with a corresponding first electrode to face the first electrode; a conductive bonding layer disposed between the first electrode and the second electrode overlapped with each other to bond the first electrode and the second electrode; and at least one spacer disposed between the first substrate and the second substrate to overlap the pressed area, the at least one spacer having a thickness that is greater than a value obtained by summing the first height and the second height.