公开(公告)号：US20170290150A1

公开(公告)日：2017-10-05

申请号：US15505619

申请日：2015-09-08

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Takashi KASUGA ,  Yoshio OKA ,  Shigeaki UEMURA ,  Shigeyoshi NAKAYAMA ,  Jinjoo PARK ,  Sumito UEHARA ,  Hiroshi UEDA ,  Kousuke MIURA

IPC: H05K1/09 ,  C23C18/30 ,  H05K3/10 ,  H05K3/46 ,  H05K3/02 ,  C23C18/18 ,  C23C18/31

CPC classification number: H05K1/092 ,  B22F1/0018 ,  B22F1/0059 ,  B22F3/16 ,  B22F7/064 ,  B22F2998/10 ,  B22F2999/00 ,  C09D11/037 ,  C09D11/10 ,  C09D11/52 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/1879 ,  C23C18/2033 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/31 ,  C23C18/32 ,  C23C18/405 ,  C23C18/42 ,  H05K1/097 ,  H05K3/02 ,  H05K3/022 ,  H05K3/108 ,  H05K3/18 ,  H05K3/381 ,  H05K3/4661 ,  H05K2201/032 ,  H05K2203/0703 ,  H05K2203/1105 ,  C22C1/0425 ,  B22F7/08 ,  B22F1/0074 ,  C23C18/00 ,  B22F2003/248 ,  C25D7/00

Abstract: The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

公开(公告)号：US20200248287A1

公开(公告)日：2020-08-06

申请号：US16637090

申请日：2018-06-22

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Kaoru OOMORI ,  Shigeyoshi NAKAYAMA ,  Masatada NUMANO

IPC: C22C23/02 ,  C23C22/57

Abstract: A metal connection member including a Mg alloy member composed principally of magnesium, a partner member connected to the Mg alloy member, the partner member being composed principally of a metal nobler than magnesium, and a chemical conversion treatment film that covers a surface of the Mg alloy member and a surface of the partner member with covering a boundary between the Mg alloy member and the partner member.

公开(公告)号：US20210167411A1

公开(公告)日：2021-06-03

申请号：US16615033

申请日：2018-04-19

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Kei HANAFUSA ,  Hiroyuki NAKAISHI ,  Shigeyoshi NAKAYAMA

IPC: H01M8/18 ,  H01M8/0208

Abstract: A redox flow battery includes: a battery cell including a positive electrode, a negative electrode, and a membrane interposed between the positive electrode and the negative electrode; a pair of cell frames each including a bipolar plate and a frame body surrounding a circumferential edge of the bipolar plate, the pair of cell frames holding the battery cell therebetween; a positive electrolyte supplied to the positive electrode; and a negative electrolyte supplied to the negative electrode. The bipolar plate is formed of pure titanium or a titanium alloy, and the negative electrolyte has an oxidation-reduction potential of 0.0 V or higher relative to a standard hydrogen electrode.

公开(公告)号：US20170127516A1

公开(公告)日：2017-05-04

申请号：US15127165

申请日：2015-03-19

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Takashi KASUGA ,  Yoshio OKA ,  Shigeyoshi NAKAYAMA ,  Jinjoo PARK ,  Sumito UEHARA ,  Kousuke MIURA ,  Hiroshi UEDA

IPC: H05K1/09 ,  H05K3/38 ,  H05K3/10 ,  H05K3/02 ,  H05K1/05

CPC classification number: H05K1/092 ,  H05K1/05 ,  H05K3/022 ,  H05K3/108 ,  H05K3/38 ,  H05K3/384 ,  H05K2201/0154 ,  H05K2201/0257 ,  H05K2203/0709 ,  H05K2203/072

Abstract: A substrate for a printed circuit board includes a base film having an insulating property; a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film, wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles, the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 μg/cm2 or more and 10 μg/cm2 or less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.