THERMOGRAPHIC SENSOR WITH THERMAL TRANSISTORS DRIVEN BY THERMO-COUPLES

    公开(公告)号:US20220170795A1

    公开(公告)日:2022-06-02

    申请号:US17537074

    申请日:2021-11-29

    Abstract: A thermographic sensor is proposed. The thermographic sensor includes one or more thermo-couples, each for providing a sensing voltage depending on a difference between a temperature of a hot joint and a temperature of a cold joint of the thermo-couple; the thermographic sensor further comprises one or more sensing transistors, each driven according to the sensing voltages of one or more corresponding thermo-couples for providing a sensing electrical signal depending on its temperature and on the corresponding sensing voltages. A thermographic device including the thermographic sensor and a corresponding signal processing circuit, and a system including one or more thermographic devices are also proposed.

    RADIATION SENSOR WITH AN INTEGRATED MECHANICAL OPTICAL MODULATOR AND RELATED MANUFACTURING PROCESS

    公开(公告)号:US20220163383A1

    公开(公告)日:2022-05-26

    申请号:US17530785

    申请日:2021-11-19

    Abstract: Radiation sensor including a detection assembly and a chopper assembly, which are mechanically coupled to delimit a main cavity; and wherein the chopper assembly includes: a suspended movable structure, which extends in the main cavity; and an actuation structure, which is electrically controllable to cause a change of position of the suspended movable structure. The detection unit includes a detection structure, which faces the main cavity and includes a number of detection devices. The suspended movable structure includes a first shield of conductive material, which shields the detection devices from the radiation, the shielding of the detection devices being a function of the position of the suspended movable structure.

    INTEGRATED THERMAL SENSOR AND MANUFACTURING PROCESS THEREOF

    公开(公告)号:US20230087516A1

    公开(公告)日:2023-03-23

    申请号:US17931482

    申请日:2022-09-12

    Abstract: Integrated thermal sensor having a housing delimiting an internal space. A support region extends through the internal space; a plurality of thermocouple elements are carried by the support region and are electrically coupled to each other. Each thermocouple element is formed by a first and a second thermoelectrically active region of a first and, respectively, a second thermoelectrically active material, the first thermoelectrically active material having a first Seeback coefficient, the second thermoelectrically active material having a second Seeback coefficient, other than the first Seeback coefficient. At least one of the first and second thermoelectrically active regions is a silicon-based material. The first and second thermoelectrically active regions of each thermocouple element are formed by respective elongated regions extending at a mutual distance into the internal space of the housing, from and transversely to the support region.

    THERMOGRAPHIC SENSOR WITH THERMO-COUPLES ON A SUSPENDED GRID AND PROCESSING CIRCUITS IN FRAMES THEREOF

    公开(公告)号:US20220170794A1

    公开(公告)日:2022-06-02

    申请号:US17537086

    申请日:2021-11-29

    Abstract: A thermographic sensor is proposed. The thermographic sensor includes a plurality of sensing elements each comprising at least one thermo-couple. The thermographic sensor is integrated on a semiconductor on insulator body that is patterned to define a grid suspended from a substrate; for each sensing element, the grid has a frame with the cold joint of the thermo-couple, a plate with the hot joint of the thermo-couple and one or more arms sustaining the plate from the frame. The frames include one or more conductive layers of thermally conductive material for thermally equalizing the cold joints with the substrate. Moreover, each sensing element may also include a processing circuit for the thermo-couple that is integrated on the corresponding frame. A thermographic device including the thermographic sensor and a corresponding signal processing circuit, and a system including one or more thermographic devices are also proposed.

    NDIR DETECTOR DEVICE FOR DETECTING GASES HAVING AN INFRARED ABSORPTION SPECTRUM

    公开(公告)号:US20210215600A1

    公开(公告)日:2021-07-15

    申请号:US17217662

    申请日:2021-03-30

    Abstract: The device is formed in a casing including a support, a spacer body, and a mirror element fixed together. A light-emitting element and a light-receiving element are arranged on a bearing surface of the support and face a reflecting surface of the mirror element. The light-emitting element is configured to generate infrared radiation, and the light-receiving element is configured to receive light radiation reflected by the reflecting surface. The spacer body has an emission opening housing the light-emitting element and a reception opening housing the light-receiving element; the reception opening comprises a radiation-limitation portion configured to enable entry of reflected light radiation having an angle, with respect to a normal to the bearing surface, of less than a preset value.

    THERMOGRAPHIC SENSOR WITH THERMO-COUPLES ON A SUSPENDED GRID AND PROCESSING CIRCUITS IN FRAMES THEREOF

    公开(公告)号:US20230324229A1

    公开(公告)日:2023-10-12

    申请号:US18335003

    申请日:2023-06-14

    Abstract: A thermographic sensor is proposed. The thermographic sensor includes a plurality of sensing elements each comprising at least one thermo-couple. The thermographic sensor is integrated on a semiconductor on insulator body that is patterned to define a grid suspended from a substrate; for each sensing element, the grid has a frame with the cold joint of the thermo-couple, a plate with the hot joint of the thermo-couple and one or more arms sustaining the plate from the frame. The frames include one or more conductive layers of thermally conductive material for thermally equalizing the cold joints with the substrate. Moreover, each sensing element may also include a processing circuit for the thermo-couple that is integrated on the corresponding frame. A thermographic device including the thermographic sensor and a corresponding signal processing circuit, and a system including one or more thermographic devices are also proposed.

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