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公开(公告)号：US11502029B2
公开(公告)日：2022-11-15
申请号：US16927776
申请日：2020-07-13
发明人： Laurent Herard , David Parker , David Gani
IPC分类号： H01L23/498 , H01L21/48 , H01L21/3065
摘要： The present disclosure provides devices and methods in which a semiconductor chip has a reduced size and thickness. The device is manufactured by utilizing a sacrificial or dummy silicon wafer. A recess is formed in the dummy silicon wafer where the semiconductor chip is mounted in the recess. The space between the dummy silicon wafer and the chip is filled with underfill material. The dummy silicon wafer and the backside of the chip are etched using any suitable etching process until the dummy silicon wafer is removed, and the thickness of the chip is reduced. With this process, the overall thickness of the semiconductor chip can be thinned down to less than 50 μm in some embodiments. The ultra-thin semiconductor chip can be incorporated in manufacturing flexible/rollable display panels, foldable mobile devices, wearable displays, or any other electrical or electronic devices.
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2.发明授权Method for making paired lenses with an opaque barrier between, and product made 有权用于制造具有不透明屏障的成对透镜与制成的产品的方法公开(公告)号：US08937774B2
公开(公告)日：2015-01-20
申请号：US13657542
申请日：2012-10-22
发明人： Laurent Herard
IPC分类号： G02B9/00
CPC分类号： B29D11/00298 , G02B3/0031 , G02B3/0068 , G02B3/0075 , Y10T29/4998
摘要： A method comprises depositing an optical filter layer on a glass wafer, then cutting the wafer into dice. The dice are positioned on a carrier and encapsulated in a molding compound to form a reconstituted wafer, and the wafer is back-ground and polished. Lens faces are positioned on opposing surfaces of the glass dice and spacers are positioned on one side of the wafer. The wafer is then cut into lens modules, each having two side-by-side lenses with an opaque molding compound barrier between. The individual modules are attached to devices that require dual lenses, such as, e.g., proximity sensors that use a light source and a light receiver or detector.
摘要翻译： 一种方法包括在玻璃晶片上沉积光学过滤层，然后将晶片切割成骰子。 将骰子定位在载体上并封装在模制化合物中以形成重构的晶片，并且将晶片进行背面和抛光。 透镜面定位在玻璃骰子的相对表面上，并且间隔物位于晶片的一侧。 然后将晶片切成透镜模块，每个透镜模块具有两个并排的透镜，其间具有不透明的模制化合物屏障。 各个模块附接到需要双透镜的装置，例如使用光源和光接收器或检测器的接近传感器。
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公开(公告)号：US10355146B2
公开(公告)日：2019-07-16
申请号：US16027647
申请日：2018-07-05
发明人： Jing-En Luan , Laurent Herard , Yong Jiang Lei
IPC分类号： H01L31/0203 , G01S7/481 , H01L31/12 , H01L31/153 , H01L31/18 , G01S17/02 , G01S17/46 , H01L31/173 , H01L25/00
摘要： One or more embodiments are directed to system in package (SiP) for optical devices, such as proximity sensing or optical ranging devices. One embodiment is directed to an optical sensor package that includes a substrate, a sensor die coupled to the substrate, a light-emitting device coupled to the substrate, and a cap. The cap is positioned around side surfaces of the sensor die and covers at least a portion of the substrate. The cap includes first and second sidewalls, an inner wall having first and second side surfaces and a mounting surface, and a cover in contact with the first and second sidewalls and the inner wall. The first and second side surfaces are transverse to the mounting surface, and the inner wall includes an opening extending into the inner wall from the mounting surface. A first adhesive material is provided on the sensor die and at least partially within the opening, and secures the inner wall to the sensor die.
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公开(公告)号：US20140061447A1
公开(公告)日：2014-03-06
申请号：US14017768
申请日：2013-09-04
发明人： Colin Campbell , Laurent Herard
CPC分类号： G01S17/026 , G01R3/00 , G01S7/4813 , Y10T29/49002
摘要： A sensor package includes a radiation source and a radiation detector provided on a substrate. A cover member is mounted on or affixed to the substrate over the source and detector. The cover member includes an opaque housing, a first transparent portion provided over the source, a second transparent portion provided over the detector and a transparent insert within the housing and positioned at one of said transparent portions. An opaque protrusion is provided on the housing separating a region associate with the first transparent portion (and radiation source) from a region associated with the second transparent portion (and detector), the protrusion attached to a surface of the substrate.
摘要翻译： 传感器封装包括辐射源和设置在基板上的辐射检测器。 覆盖构件安装在基底上或固定到源和检测器上。 盖构件包括不透明壳体，设置在源极上的第一透明部分，设置在检测器上方的第二透明部分和位于壳体内并位于所述透明部分之一处的透明插入件。 在壳体上设置不透明突起，该区域与第二透明部分（和检测器）相关联的区域与第一透明部分（和辐射源）相关联的区域分离，所述突起附接到基板的表面。
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公开(公告)号：US10147834B2
公开(公告)日：2018-12-04
申请号：US14885215
申请日：2015-10-16
发明人： Laurent Herard , David Gani
IPC分类号： H01L31/167 , H01L25/16 , H01L31/18 , H01L31/0203 , H01L33/00 , H01L33/58 , G01S17/02 , H01L31/16 , G01S7/481 , G01D5/347 , H01L33/54
摘要： An electronic device includes a substrate, an optical sensor coupled to the substrate, and an optical emitter coupled to the substrate. A lens is aligned with the optical emitter and includes an upper surface and an encapsulation bleed stop groove around the upper surface. An encapsulation material is coupled to the substrate and includes first and second encapsulation openings therethrough aligned with the optical sensor and the lens, respectively.
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6.发明申请METHOD FOR MAKING PAIRED LENSES WITH AN OPAQUE BARRIER BETWEEN, AND PRODUCT MADE 有权用于制造具有OPAQUE BARRIER的成对镜片和产品的方法公开(公告)号：US20140111875A1
公开(公告)日：2014-04-24
申请号：US13657542
申请日：2012-10-22
发明人： Laurent Herard
CPC分类号： B29D11/00298 , G02B3/0031 , G02B3/0068 , G02B3/0075 , Y10T29/4998
摘要： A method comprises depositing an optical filter layer on a glass wafer, then cutting the wafer into dice. The dice are positioned on a carrier and encapsulated in a molding compound to form a reconstituted wafer, and the wafer is back-ground and polished. Lens faces are positioned on opposing surfaces of the glass dice and spacers are positioned on one side of the wafer. The wafer is then cut into lens modules, each having two side-by-side lenses with an opaque molding compound barrier between. The individual modules are attached to devices that require dual lenses, such as, e.g., proximity sensors that use a light source and a light receiver or detector.
摘要翻译： 一种方法包括在玻璃晶片上沉积光学过滤层，然后将晶片切割成骰子。 将骰子定位在载体上并封装在模制化合物中以形成重构的晶片，并且将晶片进行背面和抛光。 透镜面定位在玻璃骰子的相对表面上，并且间隔物位于晶片的一侧。 然后将晶片切成透镜模块，每个透镜模块具有两个并排的透镜，其间具有不透明的模制化合物屏障。 各个模块附接到需要双透镜的装置，例如使用光源和光接收器或检测器的接近传感器。
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公开(公告)号：US11942496B2
公开(公告)日：2024-03-26
申请号：US17326537
申请日：2021-05-21
发明人： Laurent Herard , David Gani
IPC分类号： H01L27/146
CPC分类号： H01L27/14618
摘要： A digital image sensor package includes an image sensor substrate and a glass covering. The image sensor substrate carries photodiodes. The glass covering has a bottom surface, a top surface opposite the bottom surface, and a sidewall delimiting a perimeter edge of the glass covering. The glass covering overlies the photodiodes. A surface area of the top surface of the glass covering is greater than a surface area of the bottom surface of the glass covering such that the sidewall is anti-perpendicular to the top and bottom surfaces of the glass.
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公开(公告)号：US11193821B2
公开(公告)日：2021-12-07
申请号：US16213197
申请日：2018-12-07
发明人： Laurent Herard , David Gani
摘要： One or more embodiments are directed to ambient light sensor packages, and methods of making ambient light sensor packages. One embodiment is directed to an ambient light sensor package that includes an ambient light sensor die having opposing first and second surfaces, a light sensor on the first surface of the ambient light sensor die, one or more conductive bumps on the second surface of the ambient light sensor die, and a light shielding layer on at least the first surface and the second surface of the ambient light sensor die. The light shielding layer defines an opening over the light sensor. The ambient light sensor package may further include a transparent cover between the first surface of the ambient light sensor die and the light shielding layer, and an adhesive that secures the transparent cover to the ambient light sensor die.
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公开(公告)号：US10038108B2
公开(公告)日：2018-07-31
申请号：US15340216
申请日：2016-11-01
发明人： Jing-En Luan , Laurent Herard , Yong Jiang Lei
IPC分类号： H01L31/12 , G06M7/00 , H01L31/0203 , H01L31/18 , G01S7/481 , H01L31/153 , H01L25/00
CPC分类号： H01L31/0203 , G01S7/481 , G01S7/4813 , G01S17/026 , G01S17/46 , H01L25/50 , H01L31/125 , H01L31/153 , H01L31/173 , H01L31/18
摘要： One or more embodiments are directed to system in package (SiP) for optical devices, such as proximity sensing or optical ranging devices. One embodiment is directed to an optical sensor package that includes a substrate, a sensor die coupled to the substrate, a light-emitting device coupled to the substrate, and a cap. The cap is positioned around side surfaces of the sensor die and covers at least a portion of the substrate. The cap includes first and second sidewalls, an inner wall having first and second side surfaces and a mounting surface, and a cover in contact with the first and second sidewalls and the inner wall. The first and second side surfaces are transverse to the mounting surface, and the inner wall includes an opening extending into the inner wall from the mounting surface. A first adhesive material is provided on the sensor die and at least partially within the opening, and secures the inner wall to the sensor die.
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