-
公开(公告)号：US10284171B2
公开(公告)日：2019-05-07
申请号：US15449104
申请日：2017-03-03
摘要： An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.
-
公开(公告)号：US10075146B2
公开(公告)日：2018-09-11
申请号：US15344878
申请日：2016-11-07
发明人： Yosuke Hamaoka , Mitsuhiro Furukawa , Toru Yamaji
IPC分类号： H03H9/10 , H03H9/02 , H03H3/10 , H03H3/02 , H03H9/13 , H03H9/56 , H03H9/72 , H03H9/19 , H03H9/70
CPC分类号： H03H9/1092 , H03H3/02 , H03H3/10 , H03H9/02984 , H03H9/02992 , H03H9/1064 , H03H9/13 , H03H9/19 , H03H9/56 , H03H9/70 , H03H9/725
摘要： An elastic wave device including a sealing structure. Examples of the elastic wave device include a piezoelectric substrate, an IDT electrode provided on the substrate, a first wiring electrode provided on the substrate adjacent the IDT electrode, a second wiring electrode provided on the first wiring electrode, and a dielectric sealing structure that extends over and seals an excitation space above the IDT electrode in which the IDT electrode excites the elastic wave. The second wiring electrode includes a protrusion formed on its outer periphery and extending beyond the first wiring electrode into the excitation space. The first and/or second wiring electrodes are electrically connected to the IDT electrode. The dielectric sealing structure includes a sealing wall provided on the second wiring electrode, the sealing wall being spaced apart from the IDT electrode by the protrusion and having a side surface that defines a side edge of the excitation space.
-
公开(公告)号：US20170170797A1
公开(公告)日：2017-06-15
申请号：US15438402
申请日：2017-02-21
CPC分类号： H03H3/02 , H01L41/0472 , H01L41/107 , H03H9/02944 , H03H9/02992 , H03H9/17 , H03H9/54 , H03H9/605 , H03H9/6463 , H03H9/6483
摘要： Methods and apparatus for reducing electric loss in an elastic wave element. In one example such a method includes forming an IDT electrode on a piezoelectric body, and forming the connection wiring on the piezoelectric body and electrically connecting the connection wiring to the IDT electrode. Forming the connection wiring includes sequentially forming a lower connection wiring on an upper surface of the piezoelectric body and forming an upper connection wiring over the lower connection wiring. The method further includes forming a reinforcement electrode over the connection wiring that divides the upper connection wiring into first and second upper connection wirings electrically connected to one another by the reinforcement electrode. The reinforcement electrode is formed abutting an upper surface of the lower connection wiring between the first and second upper connection wirings and electrically connected to the lower connection wiring and to the first and second upper connection wirings.
-
公开(公告)号：US10389326B2
公开(公告)日：2019-08-20
申请号：US15438402
申请日：2017-02-21
IPC分类号： H03H3/02 , H03H9/02 , H03H9/64 , H01L41/047 , H01L41/107 , H03H9/17 , H03H9/54 , H03H9/60
摘要： Methods and apparatus for reducing electric loss in an elastic wave element. In one example such a method includes forming an IDT electrode on a piezoelectric body, and forming the connection wiring on the piezoelectric body and electrically connecting the connection wiring to the IDT electrode. Forming the connection wiring includes sequentially forming a lower connection wiring on an upper surface of the piezoelectric body and forming an upper connection wiring over the lower connection wiring. The method further includes forming a reinforcement electrode over the connection wiring that divides the upper connection wiring into first and second upper connection wirings electrically connected to one another by the reinforcement electrode. The reinforcement electrode is formed abutting an upper surface of the lower connection wiring between the first and second upper connection wirings and electrically connected to the lower connection wiring and to the first and second upper connection wirings.
-
公开(公告)号：US09503050B2
公开(公告)日：2016-11-22
申请号：US14810122
申请日：2015-07-27
发明人： Yosuke Hamaoka , Mitsuhiro Furukawa , Toru Yamaji
CPC分类号： H03H9/1092 , H03H3/02 , H03H3/10 , H03H9/02984 , H03H9/02992 , H03H9/1064 , H03H9/13 , H03H9/19 , H03H9/56 , H03H9/70 , H03H9/725
摘要： An elastic wave device that can be downsized. Certain examples of the elastic wave device include a substrate, an IDT electrode provided above the substrate, a wiring electrode provided above the substrate and connected to the IDT electrode, a sealing body sealing an excitation space in which the IDT electrode excites an elastic wave, and a sealing wall provided above the wiring electrode and forming a part of the sealing body. An outer periphery of the wiring electrode includes a protrusion. In one example, the wiring electrode includes a first wiring electrode provided on an upper surface of the substrate and a second wiring electrode provided on an upper surface of the first wiring electrode, an outer periphery of the second wiring electrode being provided with the protrusion.
摘要翻译： 可以减小弹性波的装置。 弹性波装置的一些例子包括基板，设置在基板上的IDT电极，设置在基板上方并与IDT电极连接的布线电极，密封体内IDT电极激发弹性波的激发空间的密封体， 以及设置在布线电极上方并形成密封体的一部分的密封壁。 布线电极的外周包括突起。 在一个示例中，布线电极包括设置在基板的上表面上的第一布线电极和设置在第一布线电极的上表面上的第二布线电极，第二布线电极的外周设有突起。
-
公开(公告)号：US20170179921A1
公开(公告)日：2017-06-22
申请号：US15449104
申请日：2017-03-03
CPC分类号： H03H9/02992 , H01L41/29 , H03H3/08 , H03H9/02834 , H03H9/02897 , H03H9/02937 , H03H9/02984 , H03H9/25 , H03H9/725
摘要： An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.
-
7.发明授权公开(公告)号：US09628047B2
公开(公告)日：2017-04-18
申请号：US14789092
申请日：2015-07-01
CPC分类号： H03H9/02992 , H01L41/29 , H03H3/08 , H03H9/02834 , H03H9/02897 , H03H9/02937 , H03H9/02984 , H03H9/25 , H03H9/725
摘要： An elastic wave device including a substrate, an interdigital transducer (IDT) electrode provided on an upper surface of the substrate, a first wiring electrode provided on the upper surface of the substrate and connected to the IDT electrode, a dielectric film that does not cover a first region of the first wiring electrode but covers a second region of the first wiring electrode above the substrate, the first wiring electrode including a cutout in the second region, and a second wiring electrode that covers an upper surface of the first wiring electrode in the first region and an upper surface of the dielectric film in the second region above the substrate.
-
公开(公告)号：US09614495B2
公开(公告)日：2017-04-04
申请号：US14624993
申请日：2015-02-18
IPC分类号： H03H9/64 , H03H9/02 , H01L41/047 , H01L41/107 , H03H9/60
CPC分类号： H03H3/02 , H01L41/0472 , H01L41/107 , H03H9/02944 , H03H9/02992 , H03H9/17 , H03H9/54 , H03H9/605 , H03H9/6463 , H03H9/6483
摘要： Methods and apparatus for reducing electric loss in an elastic wave element. In one example, the elastic wave element includes a piezoelectric body having a upper surface, an interdigital transducer (IDT) electrode disposed on the piezoelectric body, a connection wiring disposed on the piezoelectric body and electrically connected to the IDT electrode, the connection wiring having a lower connection wiring and an upper connection wiring provided above the lower connection wiring, and a reinforcement electrode provided above the connection wiring, the reinforcement electrode being in contact with and electrically connected to the lower connection wiring.
-
公开(公告)号：US20170054428A1
公开(公告)日：2017-02-23
申请号：US15344878
申请日：2016-11-07
发明人： Yosuke Hamaoka , Mitsuhiro Furukawa , Toru Yamaji
CPC分类号： H03H9/1092 , H03H3/02 , H03H3/10 , H03H9/02984 , H03H9/02992 , H03H9/1064 , H03H9/13 , H03H9/19 , H03H9/56 , H03H9/70 , H03H9/725
摘要： An elastic wave device including a sealing structure. Examples of the elastic wave device include a piezoelectric substrate, an IDT electrode provided on the substrate, a first wiring electrode provided on the substrate adjacent the IDT electrode, a second wiring electrode provided on the first wiring electrode, and a dielectric sealing structure that extends over and seals an excitation space above the IDT electrode in which the IDT electrode excites the elastic wave. The second wiring electrode includes a protrusion formed on its outer periphery and extending beyond the first wiring electrode into the excitation space. The first and/or second wiring electrodes are electrically connected to the IDT electrode. The dielectric sealing structure includes a sealing wall provided on the second wiring electrode, the sealing wall being spaced apart from the IDT electrode by the protrusion and having a side surface that defines a side edge of the excitation space.
摘要翻译： 一种包括密封结构的弹性波装置。 弹性波装置的实例包括压电基板，设置在基板上的IDT电极，设置在与IDT电极相邻的基板上的第一布线电极，设置在第一布线电极上的第二布线电极以及延伸的介电密封结构 并且密封IDT电极上方的IDT电极上的激发空间，其中IDT电极激发弹性波。 第二布线电极包括在其外周上形成并突出超过第一布线电极进入激励空间的突起。 第一和/或第二布线电极电连接到IDT电极。 电介质密封结构包括设置在第二布线电极上的密封壁，密封壁通过突起与IDT电极间隔开并且具有限定激发空间的侧边缘的侧表面。
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.022 秒)
